Pick and Place Semiconductor Die with Temporary Storage
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Solution Overview
Problem
In the fabrication of system on integrated chips (SoICs) using hybrid die-to-die bonding processes, precision in pick and place operations is critical to prevent misalignment, leading to decreased manufacturing yield when disturbances occur, resulting in scrapped dice that cannot be accurately realigned.
Innovation Solution
A pick and place method involving a suction device, temporary storage device with optical detectors and cameras, and a controller to detect events and realign semiconductor elements, allowing for transfer and positioning without the need for dice realignment, thereby preventing scrapping and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If extreme precision is required in pick and place operations to prevent misalignment, then bonding quality is improved, but manufacturing yield deteriorates when disturbances occur
Solution Approach 1:
The patent implements a temporary storage device that can hold the picked die in a suspended state before final placement. This preliminary storage capability allows the system to pause the pick-and-place operation when disturbances are detected, preserving the precisely positioned die without forcing a rushed placement that would compromise alignment. The controller detects disturbances and triggers storage mode, maintaining the die in a controlled environment until conditions are favorable for accurate placement.
Solution Approach 2:
The temporary storage device acts as an intermediary between the pickup device and the final placement location. This intermediate component buffers the system against disturbances by providing a stable holding position where the die can be preserved until the disturbance passes. The storage device with optical detectors serves as a mediator that decouples the timing of pickup from placement, allowing the system to maintain precision even when external conditions are unfavorable.
2Manufacturing precision
If the picked die is scrapped when disturbances occur, then alignment precision is maintained, but manufacturing yield deteriorates
Solution Approach 1:
Instead of scrapping the die when disturbances occur, the system uses the temporary storage device to preserve the die in its currently positioned state. This preliminary storage action allows the system to wait out the disturbance and attempt placement later when alignment conditions are favorable, thereby salvaging dice that would otherwise be discarded and improving manufacturing yield.
Solution Approach 2:
The patent implements a recovery mechanism where dice that would traditionally be scrapped due to disturbances are instead recovered through temporary storage. The system holds the die in the temporary storage device during disturbances and attempts repositioning or placement after the disturbance passes, effectively recovering value from dice that would have been lost and improving overall productivity.
3Reliability
If a temporary storage device with optical detectors is added, then manufacturing yield is improved, but device complexity increases
Solution Approach 1:
The temporary storage device is designed with multi-functionality to justify its addition to the system. It serves not only as a holding position but also incorporates optical detectors for positioning verification, disturbance detection capabilities, and integration with the controller system. This multi-functional design consolidates several functions into one component, reducing the need for separate dedicated devices for each function and thereby limiting the increase in overall system complexity.
Solution Approach 2:
The temporary storage device is equipped with optical detectors that enable it to autonomously detect the position of the die and provide feedback to the controller. This self-service capability reduces the need for external monitoring systems and manual intervention, allowing the storage device to actively contribute to positioning accuracy and disturbance detection without requiring proportionally complex external support systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables accurate realignment and transfer of semiconductor elements during disturbances, such as earthquakes or power outages, reducing manufacturing waste and improving yield by utilizing a temporary storage device with optical detection and positioning capabilities.
Implementation Method 1
at least one optical detector disposed below the platform and configured to detect a position of the at least one semiconductor element
Implementation Method 2
an optical camera disposed below the platform and configured to capture an image of the at least one semiconductor element
Data Source
AI summary
A pick and place method and apparatus thereof are provided. The pick and place method includes: providing at least one semiconductor element disposed on a source storage location; picking up the at least one semiconductor element from the source storage location; transferring the at least one semiconductor element to a temporary storage device according to a signal; positioning the at least one semiconductor element through the temporary storage device; and picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.