Pick and Place Sensor Data Latency Heat Management
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Solution Overview
Problem
Existing pick and place machines face challenges in accurately positioning components due to data latency and heat production issues, limiting the complexity and speed of calculations in sensors, which restricts the rotational speed and accuracy of component placement.
Innovation Solution
A method where sensor data and rotational data are combined into a data set within the sensor, then sent to a stationary computer for processing, allowing for more complex and flexible processing without heat-related limitations, enabling accurate and reliable component orientation determination and placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the alignment processing unit is located stationary in the pick and place machine, then data transfer distance is large causing data latency, but if located in the sensor housing, then heat production increases affecting placement accuracy
Solution Approach 1:
The processing system is segmented into two parts: a motion control unit located in the sensor housing that performs real-time processing of sensor data and encoder data, and a stationary alignment processing unit that handles non-real-time alignment calculations. This segmentation allows real-time processing to occur close to the data sources (reducing latency) while separating heat-generating components from the placement unit (reducing thermal impact on accuracy).
Solution Approach 2:
The motion control unit acts as an intermediary between the sensor/actuator and the stationary alignment processing unit. It receives sensor data and encoder data, performs initial real-time processing, and transmits processed results to the alignment processing unit. This intermediary role enables real-time response while distributing computational load and thermal generation away from the placement-critical components.
2Productivity
If processing electronics power is increased in the sensor, then calculation complexity and speed improve, but heat production increases affecting placement accuracy
Solution Approach 1:
Computational tasks are segmented and distributed: the motion control unit in the sensor housing handles time-critical real-time processing with moderate power consumption, while the stationary alignment processing unit handles computationally intensive but non-time-critical alignment calculations. This segmentation enables high calculation speed where needed without concentrating all heat-generating processing in the placement unit.
Solution Approach 2:
Different processing units are assigned different quality characteristics: the motion control unit is optimized for real-time response with sufficient processing power for immediate data handling, while the alignment processing unit is optimized for computational complexity with no thermal constraints. This local quality differentiation allows each unit to operate at optimal performance without compromising placement accuracy through heat generation.
3Reliability
If sensor read out timing is not synchronised with rotational speed, then jitter occurs between encoder data and sensor data, but synchronisation requires constant velocities limiting operational flexibility
Solution Approach 1:
The motion control unit implements feedback mechanisms that continuously monitor encoder data from the actuator and use this information to synchronize sensor readout timing. The system uses the encoder feedback to adjust sampling timing dynamically, ensuring data synchronisation without requiring constant rotational velocities. This feedback approach maintains reliability while enabling variable speed operation.
Solution Approach 2:
The system transitions from a static synchronization approach (requiring constant velocity) to a dynamic synchronization approach where the motion control unit continuously adapts sensor readout timing based on actual actuator position feedback. This dynamic timing adjustment maintains data alignment reliability while allowing the actuator to operate at variable speeds, improving operational flexibility.
Data Source
AI summary
A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.