Pick-and-Place Stabilizer for Accurate Hybrid Bonding Alignment
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Solution Overview
Problem
The challenge in semiconductor packaging lies in accurately aligning and placing dies without compromising system throughput, particularly due to shaky and unsteady moving parts in pick-and-place systems, which results in position shift errors that limit bonding density in hybrid bonding processes.
Innovation Solution
A pick-and-place system with a gantry driven by a primary drive mechanism and a stabilizer extending downwardly, combined with a vision alignment camera and optics alignment system, reduces position shift errors by providing alignment feedback and stabilizing the suction head during die placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a pick-and-place system is used for die placement, then productivity is improved, but manufacturing precision deteriorates due to position shift errors from shaky moving parts
Solution Approach 1:
The patent introduces a stabilizer as an intermediary component between the gantry and the substrate. The stabilizer extends downwardly from the gantry and contacts the substrate to provide mechanical support and reduce vibrations during the pick-and-place operation, thereby improving positioning precision without compromising throughput
Solution Approach 2:
The system is divided into separate functional components: the gantry for movement, the stabilizer for vibration reduction, and the suction head for die handling. This segmentation allows each component to be optimized independently - the stabilizer can be tuned specifically for vibration damping while the gantry maintains its throughput capability
2Manufacturing precision
If a stabilizer is added to reduce position shift errors, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The stabilizer is applied locally at the critical interface between the gantry and the substrate, rather than requiring a complete redesign of the entire system. This localized intervention provides the necessary stability improvement with minimal added complexity
Solution Approach 2:
The stabilizer design uses a simple geometric form that can be easily manufactured and replicated. The downwardly extending structure from the gantry is a straightforward mechanical feature that does not require complex machining or assembly procedures
Data Source
AI summary
A pick-and-place system is provided. The pick-and-place system includes: a wafer holder configured to hold a bottom die; a gantry having a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry horizontally and vertically; a suction head configured to hold a top die; and a secondary drive mechanism located at the gantry and connected to the suction head and configured to drive the suction head horizontally and vertically to place the top die on the bottom die at a target position. The primary drive mechanism drives the gantry vertically until the stabilizer is in contact with the bottom die before the secondary drive mechanism drives the suction head.