Pick-and-Place Suction Head With Die Warpage Correction
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving accurate alignment and bonding of dies due to warpage issues in pick-and-place tools, which can lead to weak bonding strength and structural instability in semiconductor packages.
Innovation Solution
A novel pick-and-place tool with a warpage-correction mechanism that applies a downward force to correct the warpage of the top die, ensuring a flat interface and sufficient bonding strength by using a pushing mechanism or rolling mechanism to eliminate gaps between the top and bottom dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional pick-and-place tool is used to bond dies, then the bonding process can be completed, but warpage of the top die causes misalignment and weak bonding strength
Solution Approach 1:
The warpage-correction mechanism applies corrective force to the top die before the bonding process to flatten it and eliminate gaps. This preliminary action ensures proper alignment and contact between the top and bottom dies, preventing misalignment and weak bonding that would occur with conventional tools that bond dies in their warped state.
Solution Approach 2:
The mechanism changes the physical state of the top die by applying controlled mechanical force to alter its shape from warped to flat. This parameter change in the die's geometric configuration enables accurate alignment and strong bonding, directly resolving the contradiction between alignment accuracy and bonding strength.
2Reliability
If warpage correction is applied to the top die, then bonding strength is improved, but the device complexity increases
Solution Approach 1:
The warpage-correction mechanism is segmented into multiple independent pushing units, each equipped with its own actuator. This segmentation allows the complex function of warpage correction to be distributed across multiple simple, modular components, making the overall system more manageable and easier to control while achieving the goal of improved bonding strength.
Solution Approach 2:
The pushing units act as intermediaries between the actuator and the top die, transferring and distributing the corrective force evenly across the die's surface. This intermediary mechanism enables effective warpage correction without requiring direct complex interaction between the actuator and the die, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The warpage-correction mechanism effectively flattens the top die, ensures a tight interface, and improves the bonding strength between dies, enhancing the structural stability and performance of semiconductor packages.
Implementation Method 1
a suction unit configured to apply a suction force on a top die and pick and hold the top die
Implementation Method 2
a warpage-correction mechanism that applies a downward force to correct the warpage of the top die
Implementation Method 3
using a pushing mechanism or rolling mechanism to eliminate gaps between the top and bottom dies
Data Source
AI summary
A suction head of a pick-and-place tool for semiconductor device packaging is provided. The suction head includes: a suction unit configured to apply a suction force on a top die and pick the top die; and a warpage-correction mechanism. The warpage-correction mechanism includes a pushing mechanism, and the pushing mechanism includes a plurality of pushing units, each of the plurality of pushing units disposed in a corner region of the suction head. Each of the plurality of pushing units includes: a tubular chamber extending vertically relative to a bottom surface of the suction head; and a pusher disposed in the tubular chamber and in air-tight contact with a side wall of the tubular chamber. The pusher is movable vertically and capable of protruding out of the bottom surface of the suction head to push a corner region of the top die and apply a downward force thereon.