Pick and Place Apparatus Guiding Unit for Semiconductor Alignment
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Solution Overview
Problem
Semiconductor devices with ball-type electrical contact leads are prone to misalignment during transfer, leading to failed electrical contact with testers due to impacts during handling in conventional pick-and-place apparatuses.
Innovation Solution
A pick-and-place apparatus with a guiding unit featuring position setting pins and elastic members that interact with the carrier board to precisely position and secure semiconductor devices, minimizing impact and ensuring correct alignment during loading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are transferred using conventional pick-and-place apparatus with vacuum picking, then productivity is improved, but manufacturing precision deteriorates due to misalignment and impact during handling
Solution Approach 1:
The picking apparatus is divided into multiple independent picking units, each capable of handling semiconductor devices separately. This segmentation allows for precise individual positioning while maintaining high throughput capability through parallel operations.
Solution Approach 2:
A carrier board with positioning pins acts as an intermediary between the picking apparatus and the semiconductor devices. The positioning pins provide precise alignment references that guide the devices during transfer, eliminating misalignment issues while maintaining high transfer speed.
2Productivity
If semiconductor devices are dropped onto the carrier board during placement, then productivity is improved, but reliability deteriorates due to impact-induced misalignment
Solution Approach 1:
The carrier board is prepared in advance with positioning pins and grooves that pre-establish the correct placement positions. This preliminary preparation allows devices to be placed accurately without requiring high-precision positioning during the rapid placement operation, maintaining both speed and reliability.
Solution Approach 2:
The carrier board structure with its positioning features acts as a cushioning mechanism that absorbs placement impacts. The grooves and pins guide the devices gently into their final positions, preventing impact-induced misalignment even during high-speed dropped placement.
3Ease of operation
If the picker releases vacuum pressure to place the semiconductor device, then ease of operation is improved, but manufacturing precision deteriorates due to positioning errors during release
Solution Approach 1:
The carrier board's positioning pins and grooves provide self-aligning features that guide the semiconductor devices into correct positions automatically during the vacuum release process. This eliminates the need for complex active control during placement, simplifying operation while maintaining high precision through passive mechanical guidance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures stable and precise loading of semiconductor devices, maintaining electrical contact integrity and reducing test failures by preventing misalignment and impact-induced errors.
Implementation Method 1
a guiding unit for interacting with another loading element (B) and for guiding the picker to load the electronic devices at a correct position on another loading element (B)
Data Source
AI summary
A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.