Pickup Head Tilting Control via Correction Plate

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current semiconductor fabrication processes face challenges in precisely controlling the tilting angle of pickup heads, which affects the alignment and bonding of semiconductor chips, leading to issues like short-circuits and reduced fabrication yields, especially when dealing with fine-pitch solder balls.

Innovation Solution

A stage structure and system that includes a pickup head tilting control device with a correction plate and tilting driving mechanism, controlled by a processing circuitry, allows for precise adjustment of the suction surface angle of the pickup head to align it horizontally or to specific angles, ensuring accurate chip placement and bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the pickup head tilting control device with correction plate is added, then the alignment precision of suction surface is improved, but the device complexity increases

Engineering Contradiction:

Improvealignment precision of suction surfaceVSAvoiddevice complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

A correction plate is introduced as an intermediary component between the pickup head and the stage. The correction plate includes a correction surface that selectively contacts the suction surface of the pickup head, enabling precise angular adjustment without modifying the pickup head structure itself. This mediator approach resolves the contradiction by achieving high alignment precision while keeping the pickup head design simple.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The tilting control function is segmented from the pickup head into a separate correction plate component. This segmentation allows the correction plate to be independently adjusted and controlled by the tilting driving device, achieving precise alignment control while maintaining the simplicity of the original pickup head structure.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If the tilting angle control is added to the existing stage, then the adaptability of stage structure is improved, but the device complexity increases

Engineering Contradiction:

Improveadaptability of stage structureVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The correction plate serves multiple functions: it provides angular adjustment for the pickup head, maintains contact with the suction surface for alignment, and works with the existing stage structure. The tilting driving device can be positioned at various locations (side surface or top surface of the stage), making the system adaptable to different configuration requirements while using the same core components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If precise tilting angle control is implemented, then the bonding quality of fine-pitch solder balls is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improvebonding quality of fine-pitch solder ballsVSAvoidease of manufacture

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The correction plate acts as a mediator that enables precise angular control for bonding operations without requiring complex modifications to the pickup head or stage. By placing the correction plate between the pickup head and stage, the system achieves the necessary precision for fine-pitch solder ball bonding while keeping the manufacturing process relatively simple.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the fabrication yield by preventing defects in chip bonding, allows for precise placement of fine-pitch solder balls, and simplifies the manufacturing process by enabling easy control of the tilting angle without substantial changes to the existing stage structure.

Implementation Method 1

a tilting driving device coupled to the correction plate and configured to adjust an inclination angle of the correction plate

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

the pickup tool may be configured to catch the semiconductor chip using a vacuum pressure

Methodology Applied

Scientific EffectVacuum pressure: Vacuum

Data Source

PatentUS11456202B2Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head

Publication Date: 2022.09.27 SAMSUNG ELECTRONICS CO LTD

AI summary

A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.