Mass Transfer Pickup Site Repair for Electronic Component Yield
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Solution Overview
Problem
Current mass transferring techniques for electronic components have inefficiencies and low yield rates due to issues like empty or defective pickup sites, which hinder the efficient transfer of electronic components onto target substrates.
Innovation Solution
A method involving the inspection and repair of pickup sites using automatic optical inspection and laser-based techniques to identify and rectify empty or defective sites, ensuring all sites are occupied by functional electronic components before transferring them onto a target substrate, thereby improving the yield rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transferring technique is used to transfer multiple electronic components at once, then productivity is improved, but the yield rate deteriorates due to empty or defective pickup sites
Solution Approach 1:
The patent applies preliminary action by inspecting pickup sites before the mass transfer process and identifying empty or defective sites in advance. The system performs inspection, determination of empty/defective sites, and repair operations before the actual transfer to the target substrate, ensuring all pickup sites are ready for successful component transfer.
Solution Approach 2:
The patent implements feedback by using inspection results to determine which pickup sites are empty or defective, then using this information to guide repair operations. The system continuously monitors the pickup sites and adjusts the transfer process based on the inspection findings, ensuring high yield rate while maintaining mass transfer efficiency.
2Reliability
If pickup sites are inspected and repaired before transfer, then yield rate is improved, but device complexity increases
Solution Approach 1:
The patent merges the inspection, determination, and repair operations into an integrated process that is part of the mass transfer system. The inspection unit, determination unit, and repair unit work together as a cohesive system, combining multiple functions into a unified process that maintains complexity at acceptable levels while improving yield rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly enhances the yield rate of electronic component transfer to nearly 100%, ensuring that all components are correctly placed and functional, thereby improving manufacturing efficiency and reducing the need for additional transfer or repair steps.
Implementation Method 1
figuring out an empty pickup site from the plurality of pickup sites; figuring out a defected electronic component from the plurality of first electronic components
Implementation Method 2
removing the defected electronic component to provide an empty pickup site among the plurality of pickup sites
Data Source
AI summary
A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.