Pickup Stage Corner Block Layout for Chip Detachment From Dicing Tape
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Solution Overview
Problem
Existing semiconductor manufacturing processes face difficulties in efficiently detaching semiconductor chips from dicing tape, particularly at the chip corners, leading to issues like cracking and chipping.
Innovation Solution
A semiconductor manufacturing apparatus with a pickup stage featuring corner and central portion pushing-up blocks, designed to lift and lower semiconductor chips, which includes offset portions and elastic mechanisms to facilitate detachment without cracking, and a suction mechanism for easy separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a block pushes up a corner of the semiconductor chip during detachment, then the chip is lifted from the dicing tape, but the detachment of the chip corner from the dicing tape does not easily progress
Solution Approach 1:
The pushing-up block is divided into multiple independent pushing portions (first pushing portion and second pushing portion) that can independently push up different corners of the semiconductor chip. This segmentation allows each corner to be detached separately and simultaneously, preventing the detachment process from being hindered at any single corner while maintaining chip integrity.
Solution Approach 2:
Multiple pushing-up blocks are combined into a single integrated block structure that can push up multiple corners of the semiconductor chip simultaneously. This merging of multiple pushing functions into one coordinated unit enables synchronized detachment of all corners, improving overall detachment progress while preventing differential stress that could cause cracking.
2Productivity
If a block pushes up the corner of the semiconductor chip, then the chip is detached from the dicing tape, but cracking and chipping occur at the chip corner
Solution Approach 1:
Each pushing portion of the block is designed with specific local characteristics (pushing surfaces positioned at predetermined positions) to apply force at optimal locations on each corner. This localized quality control ensures that the pushing force is distributed appropriately to prevent stress concentration that would cause cracking, while maintaining efficient detachment.
Solution Approach 2:
The pushing-up block is designed to push up all corners of the semiconductor chip simultaneously before the detachment process begins. This preliminary simultaneous action prevents sequential stress application that could cause cracking, and ensures that the chip is uniformly lifted from the dicing tape in a controlled manner that preserves corner integrity.
Data Source
AI summary
According to the present disclosure, a semiconductor manufacturing apparatus comprises a pickup stage having a mechanism for lifting and lowering a semiconductor chip having a square shape. The pickup stage comprises first pushing-up blocks at four corners. Each of the first pushing-up blocks comprises a first side parallel to one side of the semiconductor chip, a second side parallel to another side of the semiconductor chip, and an offset portion formed between the first side and the second side to be offset to an inward side of an intersection point of respective extension lines of the first side and the second side.