PID Thermal Control for CPU Performance

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Solution Overview

Problem

Conventional thermal control systems for electronic devices, such as smartphones and tablets, employ reactive and discontinuous mechanisms with slow response times and inaccurate thermal parameters, leading to suboptimal performance of central processing units (CPUs) and graphics processing units (GPUs) under thermal constraints.

Innovation Solution

A thermal control system utilizing a proportional-integral-derivative (PID) controlling unit in a feedback loop to dynamically adjust thermal parameters and performance levels of integrated circuits, enabling proactive decision-making and maximizing CPU/GPU performance within thermal envelopes by determining target thermal parameters and generating error parameters to optimize operating frequencies and voltages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional reactive thermal control method is used, then thermal safety is maintained, but CPU/GPU performance is reduced due to early throttling

Engineering Contradiction:
Improvethermal safetyVSAvoidCPU/GPU performance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system performs preliminary thermal analysis by determining predicted future thermal parameters based on current thermal state and workload characteristics. This allows the system to proactively adjust performance levels before thermal violations occur, maintaining both thermal safety and maximizing performance by avoiding premature throttling.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements a closed-loop feedback mechanism where actual thermal parameters are continuously monitored and compared with predicted values. The difference (error thermal parameter) feeds back to the PID controller which dynamically adjusts performance levels, enabling adaptive thermal control that responds to real-time conditions while maintaining performance optimization.

Inventive Principle:
Principle #23Feedback

2Device complexity

If conventional discontinuous control mechanism is used, then control simplicity is maintained, but response time is slower than thermal response time

Engineering Contradiction:
Improvecontrol mechanism simplicityVSAvoidresponse time
Core Design Contradiction:
Device complexityVSSpeed

Solution Approach 1:

The PID controller implements continuous feedback control by constantly comparing predicted and actual thermal parameters. This continuous adjustment mechanism provides fast response times that match thermal response characteristics, eliminating the delays inherent in discontinuous control while maintaining manageable system complexity through the well-established PID control framework.

Inventive Principle:
Principle #23Feedback

3Ease of manufacture

If power lookup table method is used, then control implementation is simplified, but thermal parameters accuracy varies from part to part

Engineering Contradiction:
Improvecontrol implementation simplicityVSAvoidthermal parameters accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

Instead of using fixed power lookup tables with predetermined thresholds, the system dynamically determines thermal parameters by analyzing actual device behavior and workload characteristics. The PID controller continuously adapts control parameters based on real-time feedback, enabling accurate thermal control that accounts for part-to-part variations while maintaining implementation feasibility through systematic control methodology.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The system performs self-characterization by monitoring its own thermal response to various workloads and automatically determining accurate thermal parameters specific to each device. This self-service approach eliminates the need for manual calibration or pre-programmed lookup tables, achieving both accuracy for individual parts and implementation simplicity through automated adaptation.

Inventive Principle:
Principle #25Self-service

4Temperature

If thermal throttling is applied to maintain thermal envelope, then thermal target is met, but performance is heavily impacted even when temperature is below threshold

Engineering Contradiction:
Improvethermal envelope complianceVSAvoidCPU/GPU performance
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The system predicts future thermal parameters based on current state and workload trends, allowing it to maintain high performance levels as long as the predicted future state remains within thermal envelopes. Throttling is applied only when necessary based on predicted violations, not on conservative static thresholds, thereby maximizing performance while ensuring thermal compliance.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The control system dynamically adjusts performance levels based on real-time thermal conditions and predicted trends rather than applying static throttling policies. The PID controller continuously optimizes the performance level, enabling the system to operate at maximum performance when thermal conditions permit and smoothly reduce performance only when necessary to maintain thermal envelope compliance.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS10114432B2Thermal control system and thermal control method for electronic device
Publication Date: 2018.10.30 MEDIATEK INC
  • US10114432B2 patent drawing
  • US10114432B2 patent drawing
  • US10114432B2 patent drawing

AI summary

The present invention provides a thermal control system and a thermal control method for an electronic device. The thermal control system comprises: an integrated circuit, a determining unit, an adding unit, and a proportional-integral-derivative (PID) controlling unit. The determining unit is utilized for determining at least a target thermal parameter for the integrated circuit. The adding unit is coupled to the integrated circuit and the determining unit, and utilized for receiving the target thermal parameter and at least an actual thermal parameter of the integrated circuit to generate at least an error thermal parameter accordingly. The PID controlling unit is coupled to the adding unit and the integrated circuit, and utilized for generating at least a performance level for the integrated circuit according to the error thermal parameter.