Piezoelectric Fluid Control Cooling via Turbulent Top-Surface Flow

The patent converts the harmful heat generated by piezoelectric device operation into a beneficial effect by designing a heat dissipation structure. The housing includes a heat dissipation chamber that captures the heat generated during vibration, and a heat dissipation member (such as a finned structure or heat sink) that transfers this heat to the surrounding air flow, transforming the harmful thermal energy into useful cooling for the system.

The patent introduces a heat dissipation member as an intermediary between the piezoelectric device and the discharged fluid/air. This intermediary component captures heat from the vibration body through thermal conduction and then dissipates it to the environment through convection, preventing direct heat transfer to the discharged fluid while maintaining the fluid transfer function.

The patent converts the harmful effect of heat generation on reliability into a beneficial cooling effect. By designing the housing with integrated heat dissipation features and positioning the heat dissipation member in the air flow path, the system actively utilizes the generated heat to drive convection currents that enhance cooling, thereby maintaining operational reliability even during continuous high-power operation.

The patent addresses the thermal management problem by adding a spatial dimension to heat dissipation. Instead of relying solely on one-dimensional heat conduction paths, the design incorporates three-dimensional heat dissipation chambers and extended surface structures (fins or ribs) that increase the heat transfer surface area and create multi-directional convection flows, enhancing cooling efficiency without interfering with the fluid control operation.