Piezoelectric Head Unit Thermal Conductor Heat Sink Design
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Solution Overview
Problem
Ink jet printers with piezoelectric element-driven liquid discharge heads face print quality issues due to heat generated by the drive IC affecting ink viscosity, as the drive IC and nozzles are closely arranged, leading to high-density nozzle configurations that exacerbate this problem.
Innovation Solution
A head unit design incorporating piezoelectric elements, a protection plate, a selection circuit, a heat sink, and a thermal conductor to manage heat generated by the drive signals, ensuring efficient heat dissipation and maintaining ink viscosity, comprising a heat sink coupled with the head chip via a thermal conductor and a protection plate to shield the piezoelectric elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the drive IC and nozzles are arranged closely to achieve high-density nozzle configuration, then the nozzle density is improved, but the heat generated by the drive IC increases ink temperature and degrades print quality
Solution Approach 1:
The drive IC is extracted from the head unit and mounted on a separate circuit board, physically separating the heat source from the nozzles. This allows high-density nozzle arrangement without the drive IC being in close proximity to generate harmful heat that would affect ink viscosity and print quality.
Solution Approach 2:
A thermal conductor is introduced as an intermediary component between the head chip and the circuit board. This thermal conductor manages heat transfer, allowing the drive IC to be electrically connected to the head chip while preventing excessive heat from reaching the ink and nozzles, thus maintaining print quality.
2Device complexity
If the drive IC is disposed on the protection plate to enable direct electrical coupling with piezoelectric elements, then the device complexity is reduced, but the heat from the drive IC directly affects the piezoelectric elements and ink
Solution Approach 1:
The drive IC is extracted from the protection plate and relocated to a separate circuit board. This maintains simplified electrical coupling through the thermal conductor while removing the drive IC from direct thermal contact with the piezoelectric elements and ink, preventing temperature-related degradation.
Solution Approach 2:
The thermal conductor serves as an intermediary that provides the necessary electrical connection between the head chip and circuit board while managing heat flow. This allows electrical coupling without direct thermal coupling, protecting the piezoelectric elements from excessive heat.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces print quality degradation by managing heat and maintaining ink viscosity, allowing for high-density nozzle configurations without compromising print quality, enabling stable and precise ink discharge.
Implementation Method 1
a thermal conductor coupling the head chip and the heat sink
Implementation Method 2
a heat sink, and a thermal conductor coupling the head chip and the heat sink
Implementation Method 3
piezoelectric elements configured to be driven in accordance with a drive signal to discharge liquid from nozzles
Data Source
AI summary
A head unit includes piezoelectric elements configured to be driven in accordance with a drive signal to discharge liquid from nozzles, a protection plate protecting the piezoelectric elements, a head chip including a selection circuit disposed on the protection plate, the selection circuit being configured to select to supply or not to supply the drive signal to the piezoelectric elements, a heat sink, and a thermal conductor coupling the head chip and the heat sink.