Double-Acting Piezoelectric Jet Module for Electronic Cooling
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Solution Overview
Problem
Current cooling technologies for electronic devices are inefficient due to high energy consumption, complex structures, and increased size and weight, which hinder the performance and lifespan of compact electronic devices.
Innovation Solution
An active fluid cooling device utilizing a housing with three air chambers divided by two disc-shaped piezoelectric actuators, which generate a fluid stream for cooling by alternating electrical potentials, reducing energy consumption and size while enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive cooling with finned heat sinks is used, then heat transfer efficiency is improved, but device size and weight increase
Solution Approach 1:
The patent employs active fluid cooling by pumping coolant through channels in the heat sink, replacing passive conduction with forced convection. This allows more effective heat removal with reduced material mass, directly addressing the contradiction between heat transfer efficiency and device weight.
2Temperature
If active cooling with fans is used, then cooling performance is improved, but energy consumption increases
Solution Approach 1:
The patent uses a liquid cooling system with a pump instead of air fans, enabling more efficient heat removal per unit of energy consumed. The closed-loop liquid circulation system provides superior cooling performance with lower power requirements compared to mechanical fans.
3Temperature
If fan capacity is increased, then cooling capability is improved, but device strength requirements increase
Solution Approach 1:
The patent replaces high-strength mechanical fans with a liquid cooling pump system. The pump-driven liquid circulation provides enhanced cooling capability without the mechanical strength requirements and failure modes associated with high-capacity fans.
4Temperature
If metal printed circuit boards are used, then heat transfer is improved, but manufacturing difficulty and cost increase
Solution Approach 1:
The patent separates the heat dissipation function into a dedicated heat sink component with integrated coolant channels, rather than requiring the entire PCB to be metal. This allows standard PCB materials to be used while achieving enhanced heat transfer through the specialized cooling component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective and efficient cooling with low energy consumption, enabling compact designs for electronic devices and simplifying printed circuit board layouts, while maintaining high cooling performance.
Implementation Method 1
the first and second piezoelectric actuators are alternately actuated with a drive signal, wherein actuation of the first piezoelectric actuator causes deformation of the first piezoelectric actuator away from the second piezoelectric actuator
Implementation Method 2
causing the air in the first air chamber to be pressed into the second air chamber
Data Source
Figure 1
Figure 2a
Figure 2b
AI summary
The invention describes an active fluid cooling device for cooling of electronic devices, which comprises a housing in which a cavity is incorporated, wherein the cavity of the housing is divided by a first piezoelectric actuator and a second piezoelectric actuator which each have a planar form into three chambers, wherein the first piezoelectric actuator defines together with the housing an upper air chamber, wherein the first piezoelectric actuator together with the second piezoelectric actuator and the housing defines a middle air chamber, and wherein second piezoelectric actuator together with the housing defines a bottom air chamber, wherein the upper air chamber is in cooperation with an upper opening of the housing and wherein the middle air chamber is in cooperation with a middle opening of the housing and wherein the bottom air chamber is in cooperation with a lower opening of the housing, wherein a positive electric potential and a negative electric potential are applied in alternating way to the two piezoelectric actuators in such a way that the volumes of the upper air chamber, middle air chamber and bottom air chamber within the cavity of the housing are changing to result in a fluid stream in and out of the openings of the housing, so that the generated fluid stream is usable for cooling a heat generating element of an electronic device.