Piezoelectric MEMS Resonator Integration on Substrate
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Solution Overview
Problem
Conventional quartz resonators are limited in size due to fabrication and encapsulation methods, making them difficult to integrate with smaller-sized devices, which is a challenge as electronic devices continue to shrink in size.
Innovation Solution
The integration of piezoelectric materials with substrates to form packaged micromechanical resonators, where a piezoelectric material is enclosed within a sealed volume defined by a substrate and a cap, with conductive materials facilitating electrical connections and hermetic seals, allowing for smaller form factors without integrated circuitry on the cap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional fabrication and encapsulation methods are used for quartz resonators, then the resonators achieve reliable operation and temperature stability, but the resonators are limited to a size of about 2.5 mm×2.0 mm
Solution Approach 1:
The resonator structure is segmented into distinct functional layers: a piezoelectric material layer for vibration generation, a substrate for mechanical support, and a cap for encapsulation. This segmentation allows each component to be optimized independently, enabling smaller overall dimensions while maintaining manufacturing reliability.
Solution Approach 2:
The piezoelectric material is integrated within the substrate structure, and the cap encapsulates the piezoelectric element, creating a nested configuration. This nesting approach minimizes the overall footprint by eliminating separate packaging components, achieving compact sizes below 2.5 mm×2.0 mm while preserving the hermetic seal required for reliable operation.
2Adaptability or versatility
If conventional quartz resonators are individually packaged with minimal circuitry, then the resonators maintain high Q and temperature stability, but integration with smaller-sized devices becomes difficult
Solution Approach 1:
The patent merges the piezoelectric resonator element directly with the substrate, eliminating the need for separate packaging and external circuitry. The substrate serves dual functions as both mechanical support and electrical interconnection platform, allowing direct integration with smaller-sized devices while maintaining the high Q and temperature stability characteristics of quartz resonators.
Solution Approach 2:
The substrate is designed to perform multiple functions: providing mechanical support for the piezoelectric element, serving as an electrical interconnection platform, and enabling direct integration with other device components. This multi-functionality eliminates the need for separate packaging components, achieving versatile integration capability in compact form factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of smaller, more compact resonators that can be integrated into smaller devices, maintaining performance and functionality while accommodating the miniaturization of electronic components.
Implementation Method 1
a piezoelectric material disposed within the enclosed volume
Implementation Method 2
a second portion of the electrically conductive material between the substrate and the cap and configured to conduct a signal between the micromechanical resonator and the cap
Implementation Method 3
the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume
Data Source
AI summary
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.