Piezoelectric Oscillator Heat Conduction Path Design
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Solution Overview
Problem
Existing piezoelectric oscillators face challenges in effectively dissipating heat generated by electronic components, leading to temperature differences that hinder temperature control and frequency adjustment of quartz crystal elements.
Innovation Solution
A piezoelectric oscillator design featuring a heat conduction path with a first portion inside the overlapping area of the base member and mounting frame, and a second portion outside, electrically isolated from both the piezoelectric resonator and electronic component, to absorb and dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electronic component is disposed on the lower surface of the base member surrounded by the mounting frame, then the integrated circuit element can be mounted and connected, but heat generated by the electronic component cannot be easily released and temperature difference occurs between the quartz crystal element and the electronic component
Solution Approach 1:
The heat conduction path is divided into two distinct portions: a first heat conduction portion disposed inside the overlapping area of the base member and mounting frame, and a second heat conduction portion disposed outside the overlapping area. This segmentation allows the heat conduction path to effectively bridge the thermal gap between the electronic component and the external environment, enabling efficient heat dissipation while maintaining the mounting structure's integrity.
Solution Approach 2:
The heat conduction path acts as a thermal intermediary between the electronic component and the external environment. It provides a dedicated thermal conduction channel that does not interfere with the electrical isolation requirements, allowing heat to be conducted away from the electronic component without creating electrical interference with the piezoelectric resonator or electronic component.
2Reliability
If the heat conduction path is electrically isolated from both the piezoelectric resonator and the electronic component, then electrical interference is prevented, but heat conduction efficiency may be reduced
Solution Approach 1:
The heat conduction path serves as a non-electrical intermediary for thermal energy transfer. By using a material and configuration that conducts heat well but does not create electrical interference, the system achieves both electrical isolation and effective heat conduction. The heat conduction path may be implemented as a thermally conductive but electrically insulating structure, or as a grounded structure that does not electrically connect to the piezoelectric resonator or electronic component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for easy and effective heat dissipation from electronic components, reducing temperature differences and improving temperature control and frequency stability of the quartz crystal elements.
Implementation Method 1
a heat conduction path that is formed on at least one of the base member and the mounting frame... configured to conduct heat
Data Source
AI summary
A piezoelectric oscillator includes a base member; a piezoelectric resonator mounted on an upper surface of the base member; a lid member joined to the upper surface so as to hermetically seal the piezoelectric resonator; an electronic component mounted on a lower surface of the base member; a mounting frame joined to the lower surface so as to surround the electronic component; and a heat conduction path disposed on the base member and/or the mounting frame. The heat conduction path is electrically isolated from both of the piezoelectric resonator and the electronic component in the piezoelectric oscillator and has heat conductivity. The heat conduction path includes a first heat conduction portion inside where the base member and the mounting frame overlap, and a second heat conduction portion connected to the first heat conduction portion and disposed outside where the base member and the mounting frame overlap.