Piezoelectric Oscillator Integration on Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing piezoelectric oscillators and sensors face challenges in miniaturization due to separate cavities for piezoelectric substrates and electronic components, leading to increased manufacturing steps, complexity in wiring, and reduced productivity, while also struggling with electromagnetic interference and difficulty in thinning the devices.
Innovation Solution
A unified structure where the piezoelectric substrate integrates an excitation electrode and an oscillation circuit, including a thin film transistor, on a single surface, with single-sided wiring and a recessed vibrating part, enhancing space efficiency, reducing manufacturing steps, and minimizing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the piezoelectric substrate and electronic component are stored in separate cavities within the package, then the components are protected and organized, but the package size increases and further miniaturization becomes difficult
Solution Approach 1:
The patent merges the piezoelectric substrate and the oscillation circuit into a single integrated structure where the oscillation circuit is formed directly on the piezoelectric substrate. This eliminates the need for separate cavities and reduces the overall package size while maintaining component protection and organization.
Solution Approach 2:
The patent transitions from a three-dimensional separate-cavity structure to a two-dimensional planar integration where the oscillation circuit is formed on the surface of the piezoelectric substrate. This dimensional change enables miniaturization by utilizing the substrate surface area rather than requiring vertical stacking or separate compartments.
2Ease of manufacture
If discrete components are used for the oscillation circuit, then the circuit can be assembled, but the number of manufacturing steps increases and productivity degrades
Solution Approach 1:
The patent combines the oscillation circuit components into a single integrated circuit formed directly on the piezoelectric substrate, eliminating the need for multiple discrete components and assembly steps. This integration significantly improves manufacturing efficiency by reducing the number of assembly operations required.
Solution Approach 2:
The patent replaces the mechanical assembly of discrete components with a semiconductor fabrication process where the oscillation circuit is formed directly on the substrate using standard IC manufacturing techniques. This substitution eliminates mechanical assembly steps and improves productivity.
3Ease of operation
If discrete components are used, then the circuit can be constructed, but the component thickness increases making it hard to thin the crystal oscillator
Solution Approach 1:
The patent merges the oscillation circuit with the piezoelectric substrate, eliminating the need for separate discrete components that would add thickness. The integrated circuit is formed in the same plane as the substrate, enabling the oscillator to be thinned while maintaining circuit functionality.
4Ease of manufacture
If multiple discrete components are wired with complex circuit patterns, then the circuit connections are established, but electromagnetic coupling between patterns increases and oscillator performance deteriorates
Solution Approach 1:
The patent merges the oscillation circuit directly onto the piezoelectric substrate, dramatically reducing the wiring length and the number of interconnections required. This integration minimizes electromagnetic coupling between circuit patterns and improves oscillator performance by eliminating complex wiring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration allows for compact, high-frequency, and high-performance piezoelectric oscillators and sensors with improved productivity, reduced electromagnetic interference, and enhanced sensitivity to temperature and substance detection, while maintaining structural strength and preventing performance degradation from environmental factors.
Implementation Method 1
a piezoelectric substrate (10) having at least a vibrating part (11) and a base part (12); an excitation electrode (14) formed on the vibrating part (11)
Implementation Method 2
the oscillation circuit (15) includes a thin film transistor (123) made of one of polysilicon and monocrystalline silicon and is coupled to the excitation electrode (14)
Data Source
AI summary
A piezoelectric oscillator includes: a piezoelectric substrate having at least a vibrating part and a base part; an excitation electrode formed on the vibrating part; and an oscillation circuit formed on the base part. In the piezoelectric oscillator, the oscillation circuit includes a thin film transistor made of one of polysilicon and monocrystalline silicon and is coupled to the excitation electrode.