Piezoelectric Pump Heat-Dissipating Arrangement
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Solution Overview
Problem
Piezoelectric pumps connected in parallel face challenges in assembly due to flat bottom surfaces and suffer from heat dissipation issues, leading to potential defects from temperature rise during vibration.
Innovation Solution
A pump unit design incorporating a flow path-defining member and a heat-dissipating part with through-holes for connecting multiple piezoelectric pumps, utilizing heat-dissipating plates and auxiliary heat-dissipating parts to facilitate easy assembly and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple piezoelectric pumps are connected in parallel to increase pump flow rate, then productivity is improved, but device complexity increases due to assembly difficulties
Solution Approach 1:
The pump unit is divided into multiple independent piezoelectric pump modules that can be individually assembled and then combined through the common flow path-defining member, making the parallel connection systematic and manageable
Solution Approach 2:
The flow path-defining member serves multiple functions simultaneously: it defines the common flow path, provides mounting surfaces for multiple pumps, and integrates the individual pump outlets into a unified system, simplifying the overall assembly
2Productivity
If piezoelectric pumps operate under vibration conditions, then pump function is achieved, but heat is generated causing temperature rise that leads to defects
Solution Approach 1:
The heat generated by vibration during pump operation is converted from a harmful factor into a manageable thermal load by implementing dedicated heat-dissipating parts that actively utilize this heat generation for thermal management
Solution Approach 2:
Heat-dissipating parts are introduced as intermediary components between the piezoelectric pumps and the environment, serving as thermal mediators that facilitate heat transfer and dissipation without interfering with the pump's vibration-based pumping function
3Reliability
If heat-dissipating parts are added to manage temperature, then reliability is improved, but device complexity increases
Solution Approach 1:
The heat-dissipating parts are merged with the flow path-defining member and mounting structures, combining thermal management functionality with existing structural components rather than adding completely separate systems
Solution Approach 2:
The heat-dissipating parts are designed to perform multiple functions: they dissipate heat from the piezoelectric pumps, serve as mounting surfaces, and maintain structural integrity, thereby justifying their inclusion without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures ease of assembly and effective heat dissipation for piezoelectric pumps, enhancing their operational reliability and performance by reducing the risk of defects caused by heat buildup.
Implementation Method 1
Changes in pressure in the pump chamber enables sucking or discharging of fluid. This is done by applying alternating voltage of a predetermined frequency to the piezoelectric element, which in turn drives the vibratory plate at a resonant frequency.
Implementation Method 2
The heat generated in the plurality of piezoelectric pumps is dissipated through the heat-dissipating part.
Data Source
AI summary
A pump unit (100) includes a plurality of piezoelectric pumps (1), a flow path-defining member (50), and a heat-dissipating part (60). The plurality of piezoelectric pumps (1) each include a first flow path for sucking and discharging of fluid. The flow path-defining member (50) includes a second flow path for connection to the first flow paths in the plurality of piezoelectric pumps (1). Heat generated in the plurality of piezoelectric pumps (1) is dissipated through the heat-dissipating part (60). The heat-dissipating part (60) is disposed between the flow path-defining member (50) and each of the plurality of piezoelectric pumps (1). The heat-dissipating part (60) has through-holes through which the first flow paths are connected to the second flow path.