Resonance Inspection Probe Isolation for Parasitic Capacitance Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing non-destructive testing methods for aircraft propulsion system components face challenges in accurately interpreting resonance signals due to parasitic capacitance between sense and drive piezoelectric transducers, complicating defect detection.
Innovation Solution
A resonance inspection system with a galvanically isolated grounding subassembly and double-stacked piezoelectric transducers, using transformers to prevent parasitic capacitance and ensure accurate measurement of piezo voltage signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If sense and drive piezoelectric transducers are placed in close proximity for compact probe design, then device compactness is improved, but parasitic capacitance between transducers increases causing measurement interference
Solution Approach 1:
A grounding subassembly with galvanically isolated grounds is introduced as an intermediary between the sense and drive piezoelectric transducers. This subassembly includes a first ground connected to the sense transducer and a second ground connected to the drive transducer, with the grounds being galvanically isolated from each other. This intermediary grounding structure provides a reference potential for both transducers while preventing parasitic capacitance coupling, thus resolving the measurement interference problem while maintaining compact probe design.
2Measurement precision
If galvanically isolated grounds are implemented for sense and drive circuits, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The grounding subassembly merges the grounding functions for both the sense and drive circuits into a single integrated structure. Rather than implementing separate grounding systems, the subassembly combines both grounds with their galvanic isolation in one compact unit that connects to both transducers, thereby achieving precise measurement while minimizing the increase in device complexity.
3Reliability
If transformers are used to prevent parasitic capacitance, then reliability of measurement is improved, but device complexity and cost increase
Solution Approach 1:
The patent replaces complex transformer-based parasitic capacitance compensation circuits with a simpler galvanically isolated grounding subassembly. Instead of using transformers to actively compensate for parasitic capacitance effects, the invention uses a passive galvanic isolation structure that inherently prevents parasitic capacitance coupling between the sense and drive circuits, thereby achieving reliable defect detection with reduced device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates more precise detection of internal defects in aircraft propulsion components with reduced interference, enabling efficient in-situ inspection with minimal downtime and cost.
Implementation Method 1
The probe includes a sense piezoelectric transducer and a drive piezoelectric transducer
Implementation Method 2
The first ground is galvanically isolated from the second ground
Implementation Method 3
resonance inspection system and method for using same
Data Source
AI summary
A resonance inspection system includes a probe and a control assembly. The probe includes a sense piezoelectric transducer and a drive piezoelectric transducer. The control assembly includes a measurement channel, a signal generator, and a grounding subassembly. The measurement channel is electrically connected to the sense piezoelectric transducer by a sense circuit. The signal generator is electrically connected to the drive piezoelectric transducer by a drive circuit. The grounding subassembly includes a first ground and a second ground. The first ground is disposed on the sense circuit. The second ground is disposed on the drive circuit. The first ground is galvanically isolated from the second ground.


