Piezoelectric Resonator Frequency Stability via Humidity Conditioning

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Solution Overview

Problem

Existing methods for manufacturing piezoelectric resonator units face challenges in achieving consistent frequency characteristics due to variations in physical properties of conductive adhesives caused by humidity, leading to unpredictable frequency variations after sealing.

Innovation Solution

A method involving mounting a piezoelectric resonator on a base member using a conductive adhesive, exposing it to a high-temperature and high-humidity environment, performing frequency adjustment using an ion beam, and hermetically sealing with a lid member using a resin adhesive to control and stabilize frequency characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If frequency adjustment is performed after hermetic sealing, then the piezoelectric resonator is protected from humidity, but the conductive adhesive's physical properties change due to humidity exposure before sealing, causing frequency characteristic variations

Engineering Contradiction:
Improvefrequency characteristic stabilityVSAvoidfrequency characteristic control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by exposing the piezoelectric resonator to a high-temperature and high-humidity environment before frequency adjustment. This preliminary exposure causes the conductive adhesive to undergo physical property changes in advance, revealing frequency characteristic variations before the actual frequency adjustment step. Consequently, the frequency adjustment can be performed on the resonator with already-stabilized adhesive properties, eliminating post-adjustment variations and ensuring desired frequency characteristics are achieved and maintained.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If the piezoelectric resonator is hermetically sealed immediately after mounting, then the internal space is protected from humidity, but frequency adjustment cannot account for adhesive property changes, leading to unpredictable frequency variations

Engineering Contradiction:
Improvefrequency characteristic accuracyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces a preliminary environmental exposure step before frequency adjustment, where the mounted piezoelectric resonator is kept in a high-temperature and high-humidity environment for a predetermined time. This preliminary action allows the conductive adhesive to complete its physical property changes before the resonator undergoes frequency adjustment. By doing so, the manufacturing process accounts for adhesive variations in advance, enabling accurate frequency control without requiring complex post-sealing adjustment mechanisms.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the easy manufacture of piezoelectric resonator units with desired frequency characteristics by revealing and addressing variations in frequency characteristics before sealing, resulting in improved stability and predictability.

Implementation Method 1

performing frequency adjustment of the piezoelectric resonator by etching using an ion beam

Methodology Applied
Scientific EffectIon beam etching: Ion Beam

Data Source

PatentUS10742188B2Method of manufacturing piezoelectric resonator unit
Publication Date: 2020.08.11 MURATA MFG CO LTD
  • US10742188B2 patent drawing
  • US10742188B2 patent drawing
  • US10742188B2 patent drawing

AI summary

A method of manufacturing a piezoelectric resonator unit that includes mounting a piezoelectric resonator on a base member using a conductive adhesive, keeping the piezoelectric resonator in an environment having a temperature and a humidity higher than those of a surrounding region for a predetermined time, performing frequency adjustment of the piezoelectric resonator by etching using an ion beam, and joining a lid member to the base member using a joining material such that the piezoelectric resonator is hermetically sealed between the lid member and the base member.