Piezoelectric Resonator Integration on Silicon Substrates
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Solution Overview
Problem
Conventional quartz resonators are limited in size due to fabrication and encapsulation methods, making them difficult to integrate with smaller-sized products, which is a challenge as devices using these resonators, such as timing circuits and sensors, are shrinking in size.
Innovation Solution
Integration of piezoelectric materials like quartz with substrates, such as silicon, to form engineered substrates, where the piezoelectric resonators are bonded to the substrates and integrated with circuitry for control and detection, allowing for smaller form factors and enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fabrication and encapsulation methods are used for quartz resonators, then the resonators achieve temperature stability and high Q, but the resonators are limited to a size of about 2.5 mm×2.0 mm
Solution Approach 1:
The patent merges the quartz resonator with a silicon substrate to form an integrated device. The resonator is bonded to the substrate, allowing the combination to achieve both the temperature stability and high Q of quartz and the small size capability of silicon-based fabrication, resolving the contradiction between reliability and size
Solution Approach 2:
The patent uses an intermediary bonding process to attach the quartz resonator to the silicon substrate. This bonding interface serves as a mediator that allows the resonator to maintain its acoustic properties while being integrated into a smaller form factor compatible with modern electronics
2Ease of manufacture
If conventional packaging methods are used for quartz resonators, then the resonators are individually packaged with minimal electrical circuitry, but the overall device size cannot be reduced further
Solution Approach 1:
The patent combines the resonator, substrate, and electrical circuitry into a single integrated device. The circuitry is formed on the substrate along with the resonator, eliminating the need for separate packaging and external circuit connections, thereby reducing the overall device size while maintaining ease of manufacture through standard semiconductor fabrication processes
Solution Approach 2:
The silicon substrate serves multiple functions: it provides mechanical support for the resonator, serves as a platform for integrating electrical circuitry, and enables standard semiconductor manufacturing processes. This multi-functionality allows the device to be both easy to manufacture and compact in size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of smaller, more integrated devices with improved performance by allowing piezoelectric resonators to be fabricated in smaller sizes and integrated with semiconductor substrates, addressing the size limitations of conventional quartz resonators.
Implementation Method 1
a mechanical resonator comprising a piezoelectric material
Implementation Method 2
integrated circuitry coupled to the mechanical resonator to control operation of the mechanical resonator and/or to detect vibration of the mechanical resonator
Data Source
AI summary
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.