Piezoelectric Resonator Through Electrode Bonding

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Solution Overview

Problem

Piezoelectric resonator devices require electrode material to fill through holes for hermetic sealing, increasing costs and complexity, especially in miniaturized designs where package sizes are reduced.

Innovation Solution

A piezoelectric resonator device with a sandwich structure using flowable conductive bonding material to connect external electrode terminals to the circuit board, eliminating the need for metal electrode material in through holes by using through electrodes and parts that reduce material usage and disperse bonding stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through holes are filled with electrode material to conduct between both main surfaces of the second sealing member, then electrical conduction is achieved, but material costs increase

Engineering Contradiction:

Improveelectrical conductionVSAvoidelectrode material

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

Through electrodes are formed in the second sealing member before bonding to the piezoelectric resonator plate, establishing electrical conduction paths in advance. This preliminary formation of conductive paths eliminates the need for subsequent filling operations with electrode material, reducing material usage while ensuring reliable electrical conduction between both main surfaces

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention extracts the function of electrical conduction from the electrode material filling process and transfers it to the through electrodes formed in the sealing member. By separating the conduction function from the filling operation, the patent eliminates unnecessary material consumption while maintaining electrical connectivity

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If through holes are filled with electrode material to hermetically seal the internal space, then hermetic sealing is achieved, but manufacturing complexity increases

Engineering Contradiction:

Improvehermetic sealingVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention merges the hermetic sealing function with the through electrode structure itself. The through electrodes serve dual purposes: providing electrical conduction and acting as sealing elements when the sealing member is bonded to the piezoelectric resonator plate. This integration eliminates the need for separate filling and sealing operations, reducing manufacturing complexity while ensuring hermetic sealing

Inventive Principle:

Principle #5Merging (Combining)

3Strength

If electrode material is used to fill through holes for bonding to circuit board, then bonding strength is achieved, but material costs increase

Engineering Contradiction:

Improvebonding strengthVSAvoidbonding material

Core Design Contradiction:

StrengthVSQuantity of substance

Solution Approach 1:

The through electrodes serve self-service by providing both electrical conduction and bonding functions. When the sealing member is bonded to the circuit board, the through electrodes automatically establish electrical connections without requiring additional electrode material filling. This self-sufficient design reduces material costs while maintaining bonding strength through the bonding material

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces material costs, maintains or increases bonding strength, and prevents hermeticity issues in miniaturized devices by dispersing bonding stress and avoiding corrosion, while ensuring hermetic sealing and easy testing.

Implementation Method 1

a flowable conductive bonding material to connect external electrode terminals to the circuit board

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a piezoelectric resonator plate including a first excitation electrode formed on a first main surface of a substrate, and a second excitation electrode formed on a second main surface of the substrate

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS10333053B2Piezoelectric resonator device, and bonding structure of piezoelectric resonator device and circuit board

Publication Date: 2019.06.25 DAISHINKU CORP

AI summary

A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.