Piezo Stack Contact via Partial Material Removal
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Solution Overview
Problem
Existing methods for making electrical contact with piezo actuators, which are stacks of material and electrode layers, often result in flawed connections due to high impedance, leading to local excessive current densities and increased temperatures, especially when using conductive adhesives, compromising the high temperature resistance and durability required.
Innovation Solution
A method involving the partial removal of material layers to expose every second electrode layer close to the surface, followed by the application of an insulation structure and a contact-making structure, such as a conductive adhesive with metal particles, to enhance the contact area and reliability, while maintaining the structural integrity of the thin electrode layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive adhesive is used to make electrical contact with electrode layers, then ease of manufacture is improved, but electrical connection reliability deteriorates due to high impedance and excessive current densities
Solution Approach 1:
The patent applies preliminary action by removing material layers before applying the conductive adhesive, to expose the electrode layers in advance. This preparation ensures that the adhesive can make direct contact with the electrode surface, reducing impedance and improving electrical connection reliability before the actual bonding process occurs.
Solution Approach 2:
The patent transitions from point-contact to surface-contact by removing material layers to expose electrode surfaces. This dimensional change from zero-dimensional point contact to two-dimensional surface contact significantly increases the contact area, reducing current density and improving electrical connection reliability while maintaining ease of manufacture.
2Reliability
If material layers are completely removed to expose electrode layers, then electrical contact quality is improved, but structural integrity deteriorates
Solution Approach 1:
The patent applies local quality by selectively removing material layers only in specific regions where electrical contact is needed, rather than removing all material layers completely. This localized material removal exposes electrode layers at contact points while preserving the structural integrity of the remaining stack, achieving both good electrical contact quality and maintained strength.
Solution Approach 2:
The patent uses partial action by removing material layers only to the extent necessary to expose electrode layers for contact, rather than completely removing all material layers. This partial removal is sufficient to achieve good electrical contact quality while avoiding excessive material removal that would compromise structural integrity.
3Adaptability or versatility
If every electrode layer extends to circumferential sides (fully active stack), then functionality is improved, but contact-making complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the contact-making process into distinct steps: first removing material layers to expose electrode layers, then applying insulation structures, and finally making electrical contacts. This segmented approach simplifies the overall process for fully active stacks where all electrode layers extend to circumferential sides, reducing contact-making complexity while maintaining full functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the long-term reliability of the electrical connection by increasing the contact area and reducing the risk of excessive current densities, ensuring stable and reliable operation of the piezo actuators.
Implementation Method 1
the material layers are partially removed by means of a material-removing method in such a way that at least every second electrode layer is exposed close to the surface
Implementation Method 2
A conductive adhesive comprises electrically conductive particles, for example made of silver, gold or any other desired metal or a metal alloy, which are embedded in an insulating backing material
Implementation Method 3
a plurality of material layers that react upon application of an electric field
Data Source
AI summary
A method is provided for making electrical contact with an electronic component in the form of a stack formed from a plurality of material layers, which react upon application of an electric field, and a plurality of electrode layers, wherein each material layer is arranged between two of the electrode layers. An insulation structure is generated on at least one stack circumferential region of the stack, which exposes each second electrode layer of the at least one stack circumferential region for electrical contact to be made. Also, a contact-making structure is applied to the at least one stack circumferential region which is provided with the insulation structure. Before the step of generating the contact-making structure, the material layers are partially removed by a material-removing method such that the electrode layers are exposed close to the surface.