Piezoelectric Vibration Unit for Non-Contact Circuit Board Separation
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Solution Overview
Problem
The challenge in manufacturing multi-layer circuit boards is the warping that occurs during manual separation of plates, which affects the positioning and fabrication of subsequent components, leading to reduced yield and quality.
Innovation Solution
A method involving a vibration unit with piezoelectric material layers that, when subjected to a voltage, generates repeated deformations and separates from the adhesive layer non-contactually, preventing warping and ensuring accurate stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual separation of plates is used during circuit board manufacturing, then the process is simple and easy to operate, but warping occurs affecting positioning precision and fabrication quality
Solution Approach 1:
The patent replaces the manual mechanical separation system with an acoustic vibration system. A vibration unit generates specific frequency vibrations that propagate through the adhesive layer, causing the upper plate to separate from the lower plate without direct mechanical contact. This substitution eliminates the warping caused by manual handling while maintaining ease of operation through automated vibration control.
Solution Approach 2:
The patent directly applies mechanical vibration to solve the separation problem. The vibration unit generates vibrations at specific frequencies that resonate through the adhesive layer, creating a separation effect between the stacked plates. This vibration-based separation method avoids the warping issue inherent in manual separation while keeping the process simple and controllable.
2Device complexity
If contact separation method is used, then the device complexity is low, but the warping phenomenon reduces yield and quality
Solution Approach 1:
The patent replaces simple mechanical contact separation with an acoustic vibration field-based separation system. The vibration unit, when activated, creates vibrations that propagate through the adhesive layer, enabling non-contact separation of the plates. This approach maintains relatively low device complexity while dramatically improving manufacturing yield by eliminating warping-induced defects.
Solution Approach 2:
The patent introduces vibration as an intermediary mechanism between the separation device and the plates. Instead of direct mechanical contact, the vibration unit acts as an intermediary that transmits vibrational energy through the adhesive layer, causing the upper plate to separate from the lower plate without direct force application that would cause warping.
3Manufacturing precision
If non-contact separation using piezoelectric vibration is used, then positioning accuracy and fabrication quality are improved, but the device complexity increases due to additional layers and voltage application system
Solution Approach 1:
The vibration unit serves multiple functions: it provides structural support as part of the circuit board assembly, acts as a piezoelectric actuator for separation, and functions as a vibration generator. This multi-functionality reduces the need for separate dedicated separation mechanisms, thereby limiting the increase in device complexity while achieving high positioning accuracy through non-contact vibration-based separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents warping and ensures accurate positioning of components, thereby improving the yield and quality of the circuit board by enabling non-contact separation of plates during the manufacturing process.
Implementation Method 1
applying a voltage to the at least one piezoelectric material layer of the vibration unit to cause the at least one piezoelectric material layer to vibrate
Data Source
AI summary
A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.