Piezoelectric Vibration Heat-Dissipating Module

Solution Overview

Problem

Conventional heat-dissipating mechanisms in electronic devices are either noisy and bulky (active mechanisms) or inefficient (passive mechanisms), and they often restrict airflow direction, making it difficult to reduce the size of portable electronic devices effectively.

Innovation Solution

A heat-dissipating module utilizing a vibration element with a working part and a free end, connected through a bracket to a driving unit, which drives the vibration element to vibrate at a resonant frequency, generating a large displacement and airflow to cool electronic components, thereby reducing the overall volume and thickness of the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If an axial-flow fan or blower is used for active heat dissipation, then heat dissipation efficiency is improved, but device volume increases and noise is generated

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice volume

Core Design Contradiction:

ProductivityVSVolume of stationary object

Solution Approach 1:

The patent uses a piezoelectric actuator to drive a blade to vibrate at high frequency, generating airflow through vibration rather than rotation. This mechanical vibration approach replaces the traditional rotating fan mechanism, achieving effective heat dissipation while significantly reducing the required device volume and eliminating associated noise problems.

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The patent substitutes the mechanical rotating system (axial-flow fan or blower) with a piezoelectric actuation system. The piezoelectric actuator converts electrical energy directly into mechanical vibration of the blade, replacing the need for motors, bearings, and rotating components, thereby reducing volume and improving reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If an axial-flow fan or blower is used for active heat dissipation, then heat dissipation efficiency is improved, but noise is generated

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidnoise

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent uses a piezoelectric actuator to drive a blade to vibrate at high frequency, generating airflow through vibration rather than rotation. This mechanical vibration approach replaces the traditional rotating fan mechanism, achieving effective heat dissipation while significantly reducing the required device volume and eliminating associated noise problems.

Inventive Principle:

Principle #18Mechanical vibration

3Volume of stationary object

If heat pipes and fins are used for passive heat dissipation, then device volume is reduced, but heat dissipation efficiency decreases

Engineering Contradiction:

Improvedevice volumeVSAvoidheat dissipation efficiency

Core Design Contradiction:

Volume of stationary objectVSProductivity

Solution Approach 1:

The patent employs a piezoelectric actuator to drive a blade that vibrates and generates active airflow. This vibration-based airflow generation actively removes heat from electronic components, achieving heat dissipation efficiency comparable to active cooling systems while maintaining a compact form factor suitable for portable devices.

Inventive Principle:

Principle #18Mechanical vibration

4Volume of stationary object

If heat pipes and fins are used for passive heat dissipation, then device volume is reduced, but material cost increases

Engineering Contradiction:

Improvedevice volumeVSAvoidfabricating cost

Core Design Contradiction:

Volume of stationary objectVSEase of manufacture

Solution Approach 1:

The patent employs a piezoelectric actuator to drive a blade that vibrates and generates active airflow. This vibration-based airflow generation actively removes heat from electronic components, achieving heat dissipation efficiency comparable to active cooling systems while maintaining a compact form factor suitable for portable devices.

Inventive Principle:

Principle #18Mechanical vibration

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module effectively dissipates heat with reduced size and thickness, enhancing space utilization and cooling efficiency while allowing for flexible airflow direction, suitable for small-sized and portable electronic devices.

Implementation Method 1

drives the vibration element to vibrate at a resonant frequency, generating a large displacement and airflow

Methodology Applied

Scientific EffectResonant vibration: Resonance

Data Source

PatentUS8934240B2Heat-dissipating module

Publication Date: 2015.01.13 DELTA ELECTRONICS INC(CN)

AI summary

A heat-dissipating module is disposed within an electronic device. The heat-dissipating module includes at least one vibration element, a bracket, and a driving unit. The vibration element includes a working part and a free end. The bracket is connected with the working part of the at least one vibration element. The driving unit is connected with the bracket. When the driving unit drives the bracket to vibrate at a vibration frequency, the vibration element is moved with the bracket, and a resonant vibration causes the free end of the vibration element to generate a displacement, so that an airflow is generated at the free end of the vibration element to cool the electronic device.