Piezoelectric Vibration Module Shock Absorption Design
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Solution Overview
Problem
Conventional vibration modules using piezoelectric devices are prone to damage from external shocks and suffer from separation of the vibration plate and piezoelectric device due to material differences, leading to reduced durability and vibration performance.
Innovation Solution
A vibration module design incorporating an intermediate material like silicon, urethane, or rubber between the piezoelectric device and vibration plate, with a molding part on the piezoelectric device and an epoxy-based adhesive with low elastic modulus, enhancing the bonding strength and shock absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a ceramic-based piezoelectric device is used for vibration generation, then the device is small in size and operatable at low voltage and low power, but the device is weak to external shock and prone to damage when dropped
Solution Approach 1:
A molding part made of shock-absorbing material (silicone rubber, polyurethane, or thermoplastic elastomer) is formed around the piezoelectric device beforehand to cushion external shocks before they reach the ceramic crystal, preventing damage while maintaining the device's compact size and low-power operation
Solution Approach 2:
The vibration module uses a composite structure combining the ceramic piezoelectric device with a shock-absorbing molding part made of different material properties, creating a hybrid system that leverages the low-power benefits of ceramic piezoelectrics while adding shock resistance through the elastic molding material
2Device complexity
If the vibration plate and piezoelectric device are bonded with adhesive, then the structure is simple, but the vibration plate and piezoelectric device may separate due to different material movement during operation
Solution Approach 1:
The adhesive's elastic modulus is specifically controlled to be less than 3000 MPa, changing the mechanical parameter of the bonding material to allow sufficient flexibility that accommodates differential movement between the vibration plate and piezoelectric device while maintaining strong bonding, preventing separation during operation
3Manufacturing precision
If the piezoelectric device is fully exposed, then the vibration transmission is direct, but the contact terminal may separate from the piezoelectric device during vibration
Solution Approach 1:
The molding part is formed around the contact terminal and piezoelectric device assembly beforehand to provide mechanical support and cushioning, preventing the contact terminal from separating during vibration while maintaining direct vibration transmission through the piezoelectric device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves durability and maintains vibration characteristics by firmly combining the piezoelectric device and vibration plate, reducing damage from external shocks and extending the module's lifespan, while maintaining sufficient vibration performance.
Implementation Method 1
A specific crystal convertible between mechanical energy and electric energy is called a piezoelectric crystal, and a device manufactured by applying the piezoelectric crystal is called a piezoelectric device. When a potential is applied to the piezoelectric crystal, there is a slight change in the form of the crystal
Implementation Method 2
the intermediate material interposed between the piezoelectric device and the vibration plate... the molding part formed on the side of the piezoelectric device where the intermediate material is not formed
Implementation Method 3
the vibration plate and the piezoelectric device are bonded together with an adhesive... the adhesive is an epoxy-based adhesive with elastic modulus of less than 3000 Mpa
Data Source
AI summary
A vibration module based on a piezoelectric device includes: a piezoelectric device; a vibration plate connected to one side of the piezoelectric device by a medium of an adhesive and an intermediate material; the intermediate material interposed between the piezoelectric device and the vibration plate; and a molding part formed on the side of the piezoelectric device where the intermediate material is not formed.