Piezoelectric Vibration Apparatus for Thin Profile and Reliability

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Solution Overview

Problem

Existing vibration apparatuses face challenges such as increased thickness due to the inclusion of speakers, fragile piezoelectric devices that are easily damaged, reduced stiffness and heat dissipation due to vibration signal cable arrangements, and limited positioning options.

Innovation Solution

A vibration apparatus is designed with a simplified structure, featuring a vibration member, a vibration apparatus disposed on the rear surface of the vibration member, a supporting member with a vibration signal cable, and a conductive connection member to enhance sound pressure level and sound characteristic.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a speaker (actuator with magnet and coil) is provided in the apparatus, then sound can be generated, but the thickness of the apparatus increases

Engineering Contradiction:

Improvesound generation capabilityVSAvoidthickness of apparatus

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent replaces the traditional electromagnetic actuator (speaker with magnet and coil) with a piezoelectric device that uses piezoelectric effect to generate vibration. This substitution eliminates the need for bulky magnetic components and coil structures, thereby reducing the overall thickness of the apparatus while maintaining sound generation capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental operating principle from electromagnetic conversion to piezoelectric conversion. By utilizing the piezoelectric effect where electrical energy is directly converted to mechanical vibration, the apparatus achieves thin-profile design without sacrificing acoustic performance

Inventive Principle:

Principle #35Parameter changes

2Length of moving object

If a piezoelectric device is used to reduce thickness, then the apparatus becomes thinner, but the device becomes fragile and easily damaged by external impact

Engineering Contradiction:

Improvethickness of apparatusVSAvoidresistance to external impact

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent incorporates a vibration signal cable unload hole in the piezoelectric device structure that serves as a stress relief mechanism. This structural feature allows the device to accommodate external impacts without transmitting excessive stress to the fragile piezoelectric element, thereby preventing damage while maintaining the thin-profile advantage

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of operation

If a vibration signal cable unload hole is provided in the piezoelectric device, then cable installation is enabled, but stiffness and heat dissipation quality are reduced

Engineering Contradiction:

Improvecable installation capabilityVSAvoidstiffness of piezoelectric device

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The patent strategically positions the vibration signal cable unload hole in a specific location on the piezoelectric device where it causes minimal impact on overall structural stiffness. The hole is designed with optimized dimensions and placement to accommodate cable installation while maintaining the structural integrity and mechanical properties of the piezoelectric device

Inventive Principle:

Principle #3Local quality

4Ease of operation

If a vibration signal cable is installed in the piezoelectric device, then electrical connection is achieved, but heat occurs due to the cable in driving the device

Engineering Contradiction:

Improveelectrical connection capabilityVSAvoidheat generation in device

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation structure as an intermediary between the vibration signal cable and the piezoelectric device. This intermediate structure facilitates thermal management by providing a heat sink or thermal conduction path that prevents excessive heat accumulation in the piezoelectric device during operation, thereby enabling safe and reliable electrical connection

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances sound quality and sound pressure level characteristics, reduces the thickness of the apparatus, and improves reliability by minimizing damage from external impacts.

Implementation Method 1

a vibration apparatus disposed on a rear surface of the vibration member to vibrate the vibration member

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS12342116B2Apparatus

Publication Date: 2025.06.24 LG DISPLAY CO LTD

AI summary

An apparatus includes a vibration member, a vibration apparatus disposed on a rear surface of the vibration member to vibrate the vibration member, a supporting member on a rear surface of the vibration apparatus, the supporting member including a first surface facing the vibration member and a second surface opposite to the first surface, a vibration signal cable disposed on the first surface or the second surface of the supporting member, and a conductive connection member electrically connecting the vibration apparatus to the vibration signal cable.