Piezoactuator Flexible Circuit Board Layout Using Barrier Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing layouts of piezoactuators and flexible circuit boards face issues with precise adhesive application, orientation correction, and mechanical stability due to capillary forces leading to short circuits and increased production costs, especially in vibration level meters.
Innovation Solution
A layout system with a thin-film and thick-film electrode configuration, where the thick-film electrode creates a sealing effect and a mushroom or rivet-shaped glue connection, preventing adhesive spread and enhancing mechanical stability, using an installation aid for precise alignment and force application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conducting adhesive is applied between the flexible circuit board and piezoactuator contact points, then electrical and mechanical connection is achieved, but adhesive spread due to capillary forces causes short circuits between adjacent contacts
Solution Approach 1:
The patent introduces a barrier layer (insulating layer) as an intermediary between adjacent connection contacts. This barrier layer prevents capillary forces from acting directly between contacts, thereby stopping adhesive spread that would cause short circuits. The barrier layer acts as a mediator that allows the adhesive to fulfill its connecting function while preventing its harmful spreading effect.
Solution Approach 2:
The patent segments the connection area by introducing barrier layers that divide the space between adjacent contacts. This segmentation creates isolated zones for each connection point, preventing the adhesive from spreading to neighboring contacts. The segmentation approach maintains the necessary adhesive bonding while eliminating the short circuit risk.
2Object-affected harmful factors
If a small quantity of highly viscous adhesive is dispensed precisely, then short circuit risk is reduced, but dispensing accuracy is difficult to achieve due to surface forces and temperature dependence
Solution Approach 1:
The barrier layer serves as a mediator that confines the adhesive within specific zones. Even if the adhesive quantity or placement varies slightly, the barrier layer prevents excessive spread, making the process more tolerant of dispensing variations and reducing short circuit risks.
Solution Approach 2:
The barrier layer provides a pre-established protective structure that cushions against potential adhesive spread issues. By having the barrier layer in place before adhesive application, the system is pre-prepared to handle variations in adhesive dispensing without resulting in short circuits.
3Stability of the object's composition
If the flexible circuit board is pressed against the piezoactuator to create adhesive bonds, then mechanical stability is improved, but orientation errors cannot be corrected and excess adhesive is forced out sideways
Solution Approach 1:
The barrier layer acts as a mediator that allows pressing to occur while preventing excess adhesive from spreading sideways. The barrier layer absorbs and contains the adhesive in the intended bonding zones, enabling mechanical stability to be achieved without the harmful side effect of adhesive extrusion.
Solution Approach 2:
The barrier layer creates local quality differences in the assembly structure, with insulating regions positioned specifically between contacts. This local modification allows the pressing operation to proceed while selectively preventing adhesive spread only in critical areas where short circuits would occur.
4Ease of manufacture
If adhesive is applied before final positioning, then assembly is simplified, but position correction is no longer possible due to adhesive setting
Solution Approach 1:
The barrier layer segments the assembly process into distinct phases: first positioning and orientation correction, then adhesive application within confined zones. The barrier layer's presence from the beginning enables this segmented approach, allowing positioning to be finalized before adhesive sets, thereby maintaining both precision and simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces short circuit malfunctions from 19% to 0% by ensuring a reliable mechanical and electrical connection with improved sealing and alignment, enhancing manufacturing efficiency.
Implementation Method 1
The piezoactuator 1 is joined to the membrane 9 via a ceramic tile 7... An excitation of the piezoactuator 1 occurs via an electrical voltage, which is applied by a flexible circuit board 3 to the top side of the piezoactuator 1... produces a vibration of the piezoactuator 1
Implementation Method 2
an electrical and mechanical connection, produced by an electrically conducting adhesive, between a first connection contact on the flexible circuit board and a second connection contact on the piezoactuator
Data Source
AI summary
A layout arrangement and system consisting of a piezoactuator and a flexible circuit board, with at least one electrical and mechanical connection, produced by an electrically conducting adhesive, between a first connection contact on the circuit board and a second connection contact on the piezoactuator, wherein the connection is led through an opening in the flexible circuit board and wherein the surfaces of the connection contacts that are glued together have an essentially parallel and equally oriented normal vector, and a method for assembling and arranging the same.