Piezoelectric Package Adhesive for Accurate Temperature Compensation
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Solution Overview
Problem
Existing piezoelectric devices face challenges in accurately compensating for temperature-induced frequency changes due to thermal conductivity differences between temperature-sensitive elements and crystal elements, leading to potential discrepancies in temperature detection and reduced sensitivity.
Innovation Solution
A piezoelectric device incorporating a thermosetting resin conductive adhesive with a conductive filler, bonded to both the temperature-sensitive element and connection conductors, which reduces thermal conductivity and enhances the adhesive's elasticity, allowing for precise temperature compensation while minimizing heat transfer to the crystal element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional adhesive with high thermal conductivity is used to bond the temperature-sensitive element, then strong bonding strength is achieved, but thermal conductivity differences cause temperature discrepancies between the crystal element and temperature-sensitive element
Solution Approach 1:
The patent changes the thermal conductivity parameter of the adhesive by using a thermosetting resin with specifically controlled thermal conductivity (0.2 to 0.6 W/mK). This parameter modification ensures that the adhesive has sufficiently low thermal conductivity to minimize heat transfer and temperature discrepancies, while still providing adequate bonding strength through its thermosetting properties and elastic characteristics.
Solution Approach 2:
The patent employs a composite adhesive material consisting of thermosetting resin combined with conductive filler particles. This composite structure provides both bonding functionality and controlled thermal conductivity, creating a material that simultaneously achieves adequate adhesion strength and minimized thermal transfer to eliminate temperature detection errors.
2Use of energy by moving object
If the adhesive has high thermal conductivity to ensure good thermal contact, then heat transfer is improved, but temperature discrepancies increase due to uneven heat distribution
Solution Approach 1:
The patent inverts the conventional approach by deliberately selecting an adhesive with low thermal conductivity (0.2 to 0.6 W/mK) rather than high thermal conductivity. This parameter change prevents excessive heat transfer that would cause temperature discrepancies, while the elastic properties of the thermosetting resin ensure sufficient thermal contact without creating thermal bridges that would lead to uneven heat distribution and measurement errors.
3Productivity
If the package design is simplified to reduce manufacturing costs, then production efficiency increases, but temperature compensation precision may be compromised
Solution Approach 1:
The patent achieves temperature compensation precision through parameter control of the adhesive material itself (thermal conductivity of 0.2 to 0.6 W/mK and appropriate elastic properties) rather than through complex package structures. This approach allows for a simplified package design that reduces manufacturing steps and costs, while the carefully selected adhesive parameters ensure accurate temperature compensation by minimizing thermal interference between the crystal element and temperature-sensitive element.
Solution Approach 2:
The patent uses a conventional thermosetting resin as the adhesive material, which is readily available and cost-effective. By relying on the material properties of this common adhesive rather than expensive specialized materials or complex packaging structures, the patent achieves both cost reduction and functional performance for temperature compensation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the probability of temperature discrepancies between the crystal and temperature-sensitive elements, enhances sensitivity, and lowers manufacturing costs by simplifying the package design, thereby improving the precision and reliability of temperature compensation in piezoelectric devices.
Implementation Method 1
The conductive adhesive is configured by a thermosetting resin containing a conductive filler and is bonded to the connection conductor and the part terminal
Implementation Method 2
A piezoelectric device according to one aspect of the present disclosure includes a piezoelectric element
Implementation Method 3
The temperature sensitive component includes apart terminal and converts temperature to an electrical signal
Data Source
AI summary
A piezoelectric device includes a piezoelectric element, a package, a temperature sensitive component and a conductive adhesive. The package includes a base body and a connection conductor. The base body has electric insulation and configures a space. The space is sealed and holds the piezoelectric element. The connection conductor is located on a predetermined surface of the base body. The predetermined surface is on an outer side relative to the space. The temperature sensitive component includes apart terminal and converts temperature to an electrical signal. The conductive adhesive is configured by a thermosetting resin containing a conductive filler and is bonded to the connection conductor and the part terminal.