Piezoelectric Device Adhesive Wall for Resonance Stability
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Solution Overview
Problem
Existing piezoelectric devices face variations in resonance frequency due to inconsistent adhesive spreading between the sealing plate and the wiring board, affecting the rigidity and vibration characteristics of the vibrating plate.
Innovation Solution
A piezoelectric device configuration featuring a third substrate with through holes and electrodes, and a second substrate with a wall to suppress adhesive outflow, ensuring consistent bonding and minimizing adhesive impact on resonance frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to bond the sealing plate and wiring board, then bonding strength is improved, but resonance frequency stability deteriorates due to variable adhesive spreading
Solution Approach 1:
The patent divides the bonding area into two distinct zones: a first bonding area with sufficient adhesive for strong bonding, and a second bonding area with restricted adhesive to prevent rigidity changes. This segmentation allows the device to achieve both strong bonding and stable resonance frequency by controlling adhesive distribution in different regions.
Solution Approach 2:
The patent applies different adhesive quantities to different regions of the bonding interface. The first bonding area receives adequate adhesive for strong bonding, while the second bonding area receives limited adhesive to maintain the sealing plate's rigidity and vibration characteristics, thus achieving local optimization of both bonding strength and frequency stability.
2Strength
If adhesive spreading range increases, then bonding strength between sealing plate and wiring board is improved, but rigidity of sealing plate deteriorates
Solution Approach 1:
The bonding area is segmented into a first bonding area where adhesive provides strong bonding, and a second bonding area where adhesive is restricted to preserve rigidity. This spatial segmentation resolves the contradiction between bonding strength and rigidity maintenance.
Solution Approach 2:
Different regions of the bonding interface are given different adhesive characteristics: the first bonding area has high adhesive concentration for strength, while the second bonding area has low adhesive concentration to maintain local rigidity and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration stabilizes resonance frequency by preventing adhesive spread to the piezoelectric elements, enhancing the rigidity and vibration characteristics of the device while maintaining higher manufacturing productivity.
Implementation Method 1
a plurality of piezoelectric elements 7 and first electrodes 12, 13 electrically coupled to the piezoelectric elements 7 are placed on a first surface 4a of the first substrate 4
Implementation Method 2
a bonding portion 32 bonding the second substrate 2 and the third substrate 3
Data Source
AI summary
A piezoelectric device includes a first substrate including a first surface on which piezoelectric elements and a common terminal coupled to the piezoelectric elements are placed, a second substrate including a second surface on which a common connecting terminal coupled to a control circuit is placed, a third substrate placed between the first substrate and the second substrate and including a third surface joined to the first surface and a fourth surface facing the second surface, and bonding portions bonding the second substrate and the third substrate by an adhesive, wherein the third substrate includes a first through hole penetrating from the third surface to the fourth surface and a first through electrode provided in the first through hole and coupled to the common terminal, the common connecting terminal is coupled to the first through electrode and electrically coupled to the common terminal via the first through electrode, and the second substrate includes a wall suppressing an outflow of the adhesive on the second surface facing the third substrate.