Piezoelectric Actuator Bonding Structure for Bubble-Free Adhesive Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing mounting structures for flexible and non-flexible components using thermosetting adhesives often experience reduced bonding strength and electrical reliability due to air bubbles formed during the heating process, which compromises the mechanical and electrical connection.
Innovation Solution
A laminated body configuration with a recessed section between terminals on substrates, where the thermosetting adhesive is applied within this recessed area, allowing air to escape and preventing bubble formation, enhancing the mechanical and electrical connection between the wiring substrate and the piezoelectric actuator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting adhesive is used to connect flexible wiring substrate and non-flexible component, then mechanical and electrical connection is achieved, but air bubbles are generated during heating process reducing bonding strength and reliability
Solution Approach 1:
The invention introduces a groove structure that creates a new spatial dimension for air escape. The groove extends in the thickness direction of the flexible wiring substrate, providing a vertical pathway for air bubbles to escape during heating, rather than being trapped in the horizontal bonding plane. This dimensional approach allows the adhesive to maintain full contact between surfaces while providing an escape route for gases.
Solution Approach 2:
The invention segments the bonding interface by introducing a groove that divides the adhesive layer into distinct regions. This segmentation creates channels within the adhesive structure, allowing different zones to serve different functions: some areas maintain strong bonding while the groove region facilitates air evacuation. The groove effectively partitions the bonding area to eliminate the harmful effect of trapped air.
2Strength
If thermosetting adhesive is used to connect wiring substrate and electronic component, then mechanical bonding strength is achieved, but bubbles are generated in the adhesive during heating reducing bonding strength
Solution Approach 1:
The groove structure adds a vertical dimension to the bonding interface, creating a three-dimensional pathway for air bubble escape. During heating, air bubbles rise along the groove in the thickness direction rather than being trapped in the two-dimensional bonding plane. This maintains horizontal bonding strength while providing vertical escape routes for gases.
Solution Approach 2:
The groove acts as an intermediary structure between the flexible wiring substrate and the electronic component. It provides a dedicated pathway that mediates the conflict between maintaining adhesive contact and allowing air escape. The groove region serves as a buffer zone that facilitates gas evacuation without compromising the overall bonding interface.
3Quantity of substance
If air is present in gap between substrates during heating, then complete filling of thermosetting adhesive is achieved, but air expansion generates bubbles that lower bonding quality
Solution Approach 1:
The groove creates a vertical dimension for air management while preserving horizontal adhesive coverage. The adhesive completely fills the bonding interface including the groove region, but the groove's vertical extension provides an escape pathway for expanding air bubbles during heating, allowing complete filling without sacrificing reliability.
Solution Approach 2:
The groove introduces localized structural variation at the bonding interface. The majority of the bonding area maintains uniform adhesive coverage for strong bonding, while the groove region provides localized air escape functionality. This local modification allows the system to achieve both complete adhesive filling and bubble-free bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the occurrence of air bubbles in the thermosetting adhesive, thereby improving the reliability of the mechanical and electrical connection, ensuring stronger bonding and reduced fatigue in the piezoelectric motor, robot, and motion stage applications.
Implementation Method 1
when the flexible wiring substrate and the non-flexible component are connected to each other using a thermosetting adhesive as the connecting section, air present in a gap between the flexible wiring substrate and the non-flexible component expands in a heating process
Data Source
AI summary
An electronic apparatus includes an electronic component including a laminated body in which an intermediate layer is disposed between first and second substrates, the laminated body including a first side surface, a second side surface connected to one side of the first side surface, and a third side surface connected to the other side of the first side surface, a first terminal disposed on the first side surface of the first substrate, a second terminal disposed on the first side surface of the second substrate, and a recessed section that is positioned between the first and second terminals and that is recessed from the first side surface, a wiring substrate disposed to face the first side surface and a thermosetting adhesive that is located between the wiring substrate and the electronic component and that mechanically and electrically connects the wiring substrate and the electronic component to each other.