Piezoelectric Substrate Bonding Alignment for Rotational Accuracy
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Solution Overview
Problem
Existing bonding apparatuses face challenges in achieving high positioning accuracy in the rotational direction of substrates, which directly impacts the bonding accuracy of substrates during the bonding process.
Innovation Solution
A bonding apparatus is designed with a combination of a rough adjustment device and a fine adjustment device, where the rough adjustment device roughly positions the substrate before it is held by a holder, and the fine adjustment device, utilizing piezoelectric elements, further refines this positioning with high accuracy, allowing for precise alignment of substrates in the rotational direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single positioning device is used, then the device complexity is low, but the positioning accuracy in the rotational direction is insufficient
Solution Approach 1:
The positioning system is divided into two independent segments: a rough adjustment device for coarse positioning and a fine adjustment device for precise rotational positioning. This segmentation allows each device to be optimized for its specific function, achieving high overall positioning accuracy without requiring a single overly complex device
Solution Approach 2:
The rough adjustment device performs preliminary positioning of the substrate before it is held by the holder. This preliminary action brings the substrate close to the correct position, allowing the fine adjustment device to then make precise rotational adjustments from a near-correct starting point, thereby improving final positioning accuracy
2Manufacturing precision
If only rough adjustment is performed, then the device complexity is low, but the bonding accuracy is insufficient
Solution Approach 1:
The positioning system is divided into two independent segments: a rough adjustment device for coarse positioning and a fine adjustment device for precise rotational positioning. This segmentation allows each device to be optimized for its specific function, achieving high overall positioning accuracy without requiring a single overly complex device
Solution Approach 2:
The rough adjustment device performs preliminary positioning of the substrate before it is held by the holder. This preliminary action brings the substrate close to the correct position, allowing the fine adjustment device to then make precise rotational adjustments from a near-correct starting point, thereby improving final positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the positioning accuracy of substrates in the rotational direction, thereby enhancing the overall bonding accuracy and quality of the combined substrate.
Implementation Method 1
the fine adjustment device includes at least one first driver configured to rotate the first holder by displacing a piezoelectric element
Data Source
AI summary
A bonding apparatus includes a first holder configured to attract and hold a first substrate from above; a second holder located lower than the first holder and configured to attract and hold a second substrate from below; a moving mechanism configured to allow a first one of the first holder and the second holder to approach a second one of the first holder and the second holder; a rough adjustment device configured to roughly adjust a position in a rotational direction of the first substrate before the first substrate is attracted and held by the first holder; a fine adjustment device, including at least one first driver configured to rotate the first holder by displacing a piezoelectric element, configured to finely adjust, with the at least one first driver, the position in the rotational direction of the first substrate attracted and held by the first holder.