Piezoelectric Ceramic Chip Manufacturing via Insulating Layer Mediator
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Solution Overview
Problem
Current methods for integrating piezoelectric ceramic chips with display panels result in low yield and inaccurate tactile sensory due to issues with transfer and bonding, leading to short circuits and chip damage.
Innovation Solution
A manufacturing method involving a substrate with a piezoelectric ceramic layer and bottom electrode, transferred to a base plate with an insulating layer and etched to prevent short circuits, using laser cutting and metal bonding layers to ensure proper alignment and protection of the piezoelectric ceramic layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If piezoelectric ceramic chip is integrated with display panel using current methods, then tactile feedback function is achieved, but yield is low and short circuits occur
Solution Approach 1:
An insulating layer is introduced as an intermediary between the piezoelectric ceramic chip and the base plate. This insulating layer with openings prevents direct contact between conductive elements, eliminating short circuits while enabling proper electrical connection through the openings. The mediator resolves the contradiction by providing both electrical isolation and controlled connectivity.
Solution Approach 2:
The insulating layer is formed in advance before the piezoelectric ceramic chip is transferred to the base plate. The openings are pre-positioned to align with the electrode structures, ensuring proper electrical connection from the beginning. This preliminary action prevents short circuits and ensures high yield by avoiding misalignment issues during assembly.
2Manufacturing precision
If piezoelectric ceramic layer is transferred to base plate, then integration is achieved, but transfer precision is poor causing misalignment
Solution Approach 1:
The insulating layer serves as a mediator that facilitates precise alignment during transfer. The openings in the insulating layer are pre-formed to match the electrode positions, providing alignment references that guide the placement of the piezoelectric ceramic chip. This mediator enables high precision transfer without requiring complex alignment mechanisms.
Solution Approach 2:
The insulating layer has different properties in different regions: it is insulating in most areas to prevent short circuits, but has openings in specific locations to enable electrical connection. This local differentiation of properties provides built-in alignment features that improve transfer precision while maintaining manufacturing simplicity.
3Reliability
If edges of piezoelectric ceramic layer are exposed, then electrical connection is achieved, but short circuits occur between adjacent chips
Solution Approach 1:
The insulating layer provides localized insulation: it covers the edges of the piezoelectric ceramic layer to prevent short circuits between adjacent chips, while having openings in specific regions to allow electrical connection. This spatial differentiation of insulating and conductive regions resolves the contradiction between electrical connection and short circuit prevention.
Solution Approach 2:
The insulating layer converts the potentially harmful exposure of edges (which could cause short circuits) into a beneficial structure. By selectively covering edges while leaving openings for electrical connection, the insulating layer transforms the short circuit risk into a controlled electrical connection mechanism that enhances reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the yield of functional piezoelectric ceramic chips, preventing short circuits and chip damage, allowing for effective tactile feedback in display devices.
Implementation Method 1
separating the substrate from the bottom electrode, the piezoelectric ceramic layer, and the base plate by cutting at a contact surface between the substrate and the piezoelectric ceramic layer using a laser cutting technology
Implementation Method 2
covering the base plate on the bottom electrode, so that the first metal bonding layer and the second metal bonding layer are brought into contact, and the first metal bonding layer and the second metal bonding layer are merged as one by welding
Implementation Method 3
When an electric field is applied to a polarization direction of the piezoelectric ceramics, the piezoelectric ceramics will be mechanically deformed in a certain direction to form a certain frictional force
Data Source
AI summary
The present disclosure provides a manufacturing method for a piezoelectric ceramic chip, a piezoelectric ceramic chip assembly and a display device. The manufacturing method includes: transferring a piezoelectric ceramic layer and a bottom electrode covering the piezoelectric ceramic layer formed on a substrate to a base plate, forming an insulating layer with an opening on the base plate, so that edges of the piezoelectric ceramic layer and the bottom electrode are covered by the insulating layer, and the piezoelectric ceramic layer is exposed from the opening; etching the base plate by immersing the base plate in an etching solution for etching a material of the bottom electrode; and forming a top electrode in the opening of the insulating layer, so that the top electrode is spaced apart from the insulating layer.