Piezoelectric Active Cooling for Mobile Processor Thermal Management
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Solution Overview
Problem
Mobile computing devices face heat dissipation challenges due to increased computing power and power consumption, with passive heat dissipation techniques becoming inadequate as they struggle to keep up with the heat generated by modern processors, especially in the limited enclosure space of mobile devices.
Innovation Solution
The implementation of piezoelectric active cooling devices that oscillate a planar element within an air channel to fan air and dissipate heat, using piezoelectric bimorph actuators driven by AC signals, which can be controlled for variable cooling and are low-power, reliable, and cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive heat dissipation components (heat sinks) are used, then heat transfer from processor to exterior surface is achieved, but the ability to dissipate heat is limited by thermal conduction paths and cannot keep up with increasing processor power consumption
Solution Approach 1:
The patent replaces the passive thermal conduction mechanism with an active mechanical air pumping system. Piezoelectric actuators mechanically pump air through channels that contact the processor, creating forced convection cooling that overcomes the limitations of passive heat sinks and thermal conduction paths.
Solution Approach 2:
The patent uses pneumatic principles by introducing air flow through channels into the cooling system. The piezoelectric actuators create pressure differentials that drive air through the cooling channels, enabling active heat removal via forced convection rather than relying solely on thermal conduction.
2Productivity
If cooling fans are used for active cooling, then heat dissipation is improved, but integration into the limited enclosure space of mobile computing devices becomes difficult
Solution Approach 1:
The patent divides the cooling system into distributed segments: multiple piezoelectric actuators are placed at different locations within the device enclosure, each pumping air through local channels. This segmented approach provides effective cooling without requiring a single large fan, enabling integration into compact mobile device spaces.
Solution Approach 2:
The patent transitions from traditional horizontal fan-based cooling to a three-dimensional air pumping system where piezoelectric actuators create vertical and lateral air flows through channels. This dimensional change allows efficient heat removal within the constrained volume of mobile devices by utilizing space in multiple directions.
3Productivity
If processor power consumption and clock speeds are increased, then computing performance is improved, but heat generation increases making heat a limiting factor to computing performance
Solution Approach 1:
The patent implements preliminary cooling action by having piezoelectric actuators continuously pump air through cooling channels before the processor reaches critical temperature levels. This proactive cooling approach enables the processor to sustain higher power consumption and clock speeds by preventing heat buildup that would otherwise limit performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases processing capabilities and reduces power consumption by actively cooling components, allowing for higher processor frequencies and lower operating temperatures, thereby enhancing the thermal performance of mobile computing devices.
Implementation Method 1
piezoelectric actuators that oscillate a planar element within an air channel to fan air
Implementation Method 2
piezoelectric actuators that oscillate a planar element within an air channel to fan air
Implementation Method 3
actively cooling components, allowing for higher processor frequencies and lower operating temperatures
Implementation Method 4
The air channel may include a surface that is in thermal contact with a processor of the mobile computing device
Data Source
AI summary
Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Some embodiments utilize piezoelectric actuators that oscillate a planar element within an air channel to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.