Piezoelectric Haptic Module for Localized Feedback

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Solution Overview

Problem

Conventional haptic feedback mechanisms in electronic devices often suffer from inefficiencies in power consumption, noise generation, and size due to the need for a dedicated moving mass, and they provide non-localized and attenuated tactile feedback when integrated within the device housing.

Innovation Solution

The integration of a piezoelectric haptic feedback module on the exterior surface of electronic devices, utilizing a haptic response layer with piezoelectric material and electrodes, allows direct transfer of vibrations to the user, eliminating the need for a moving mass and enabling localized and high-frequency haptic responses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a dedicated moving mass is used in conventional haptic feedback mechanisms, then vibration can be generated, but power consumption increases and device size increases

Engineering Contradiction:
Improvepower consumptionVSAvoiddevice size
Core Design Contradiction:
PowerVSWeight of stationary object

Solution Approach 1:

The patent replaces the mechanical vibration generation system (eccentric rotating mass) with a piezoelectric-based haptic feedback module. The piezoelectric material converts electrical signals directly into mechanical vibrations without requiring a moving mass, thereby reducing power consumption and device size while maintaining haptic feedback functionality.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental operating parameter from mechanical rotation (ERM) or linear motion (LRA) to piezoelectric actuation. By applying voltage to piezoelectric material, the system generates vibrations through material expansion and contraction, fundamentally changing how haptic feedback is produced and eliminating the need for dedicated moving mass.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If haptic feedback module is integrated within the device housing, then haptic response can be provided, but the feedback is attenuated and non-localized

Engineering Contradiction:
Improvehaptic feedback consistencyVSAvoidfeedback attenuation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the haptic feedback module from the internal housing and places it on the exterior surface of the device. This extraction allows the haptic response to be delivered directly to the user's hand without passing through the housing structure, eliminating attenuation and enabling localized feedback at the contact point.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent implements localized haptic feedback by positioning the piezoelectric module directly at the user contact point on the device exterior. This allows haptic responses to be generated precisely where needed (e.g., at button locations or edge regions) rather than distributing feedback non-locally through the entire housing.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves power efficiency, reduces noise and device size, enhances reliability, and allows for customizable tactile effects by providing direct and localized haptic feedback, improving the frequency response and consistency of haptic experiences.

Implementation Method 1

a haptic response layer supported by and conforming to at least a portion of the first surface, the haptic response layer including a piezoelectric material and electrodes and configured to couple vibrations to a user to provide a haptic response to the user during operation of the device

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS10996755B2Piezoelectric haptic feedback module
Publication Date: 2021.05.04 GOOGLE LLC
  • US10996755B2 patent drawing
  • US10996755B2 patent drawing
  • US10996755B2 patent drawing

AI summary

A device comprising:a device housing defining a space for accommodating one or more electronic components, the device housing comprising:a first panel bounding the space and having an exterior surface facing away from the space, anda second panel bounding the space and including a touch-sensitive display having a display surface facing away from the space, the display surface and the exterior surface being opposite surfaces;a haptic feedback module supported by and conforming to at least a portion of the exterior surface, the haptic feedback module comprising a haptic response layer, the haptic response layer comprising a piezoelectric material and electrodes and configured to couple vibrations to a user body member in contact with the haptic feedback module to provide a haptic response to the user during operation of the device; andan electronic control module accommodated in the space and coupled to the electrodes of the haptic response layer, the electronic control module being programmed to receive a touch input signal from the touch-sensitive display and provide haptic signals to the electrodes based on the received touch input signal to activate the piezoelectric material of the haptic response layer.