Piezoelectric Acoustic Wave Structure for Safer Hollow Etching
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Solution Overview
Problem
The production efficiency of acoustic wave devices decreases, and the piezoelectric layer is easily damaged when forming a hollow portion by providing a through-hole in the piezoelectric layer.
Innovation Solution
Incorporating a raised portion along the depth direction of the through-hole on the inner wall of the piezoelectric layer, which facilitates easier introduction of an etching solution, thereby reducing unnecessary damage to the piezoelectric layer and shortening the etching period.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a through-hole is provided in the piezoelectric layer to form a hollow portion, then the hollow portion can be formed, but the piezoelectric layer is easily damaged and production efficiency decreases
Solution Approach 1:
The patent applies local quality by creating a raised portion at the bottom of the through-hole that provides localized support to the piezoelectric layer. This localized structural modification strengthens the area where the hollow portion is formed, preventing the piezoelectric layer from collapsing or becoming damaged during the etching process, while still allowing the hollow portion to be formed as intended.
2Shape
If a through-hole is provided in the piezoelectric layer to form a hollow portion, then the hollow portion can be formed, but production efficiency decreases
Solution Approach 1:
The patent applies preliminary action by forming the raised portion structure before the final hollow portion etching process. This pre-formed structural support eliminates the need for repeated etching steps or repairs during production, streamlining the manufacturing process and improving overall production efficiency while ensuring the hollow portion is formed correctly.
3Ease of operation
If a through-hole extends through the piezoelectric layer, then the hollow portion is accessible, but the piezoelectric layer becomes vulnerable to damage
Solution Approach 1:
The raised portion creates a localized reinforcement zone at the through-hole bottom that maintains piezoelectric layer integrity while allowing etching solution to access the hollow portion. The local structural enhancement provides mechanical support precisely where needed without obstructing the etching process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of damage to the piezoelectric layer during production, enhancing the efficiency and reliability of the acoustic wave device.
Implementation Method 1
an acoustic wave device including a piezoelectric layer made of lithium niobate or lithium tantalate
Data Source
AI summary
An acoustic wave device includes a piezoelectric layer including first and second main surfaces opposed to each other, a functional electrode on at least one of the first and second main surfaces, and a support substrate on a second main surface side of the piezoelectric layer. A hollow portion is between the support substrate and the piezoelectric layer. The functional electrode at least partially overlaps the hollow portion when viewed in a laminating direction in which the support substrate and the piezoelectric layer are laminated. A through-hole extends through the piezoelectric layer to the hollow portion. A raised portion extending along a depth direction of the through-hole is on an inner wall of the through-hole.