Piezoelectric Micro Blower Channel Layout for Thin Device Cooling
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Solution Overview
Problem
Conventional heat dissipation systems for electronic components face issues such as increased thermal resistance, high assembly and material costs, and inadequate cooling due to narrow channels and low thermal conductivity of cooling fins, particularly in high-power portable devices like tablets and smartphones.
Innovation Solution
A micro blower with dual-chamber piezoelectric vibrators and specially designed channels that generate directional air flow through phase difference modal resonant vibrations, utilizing a base metal sheet, flowing channel layer, sandwich metal sheet, and capping layer to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation devices are assembled from multiple components, then heat dissipation function is achieved, but assembly and material costs are increased
Solution Approach 1:
The patent integrates multiple heat dissipation components into a single integrated heat dissipation device. The device combines a heat sink body, heat dissipation fins, and airflow guiding structures into one unified component, eliminating the need for separate assembly of multiple parts while maintaining effective heat dissipation function.
Solution Approach 2:
The integrated heat dissipation device performs multiple functions simultaneously: it provides thermal conduction through the heat sink body, increases surface area for heat radiation through fins, and directs airflow to enhance convective cooling. This multi-functionality in a single component reduces both material and assembly costs.
2Ease of manufacture
If aluminum alloy cooling fins are used, then manufacturing cost is reduced, but thermal conductivity is merely at an intermediate level and unsuitable for high-power densities
Solution Approach 1:
The patent employs composite material construction for the heat dissipation device, combining materials with different thermal conductivity properties in specific configurations. The heat sink body uses high thermal conductivity material for efficient heat absorption, while the fins may use optimized aluminum alloy or alternative materials to balance thermal performance and manufacturing cost.
Solution Approach 2:
Different regions of the heat dissipation device use materials with different properties optimized for their specific functions. The base contact area with the heat generating component uses high thermal conductivity material, while the fin structures use materials optimized for cost and surface area efficiency.
3Volume of moving object
If channels are further minimized due to fining and slimming of electronic components, then device thickness is reduced, but severe pressure drop is resulted and exhaust air volume and speed are affected
Solution Approach 1:
The patent compensates for reduced channel cross-sectional area by optimizing the three-dimensional channel geometry. The channels are designed with optimized length, curvature, and cross-sectional variation along their path to minimize pressure drop while maintaining compact device thickness. The airflow path is strategically routed to maximize velocity and volume within the constrained space.
Solution Approach 2:
The channel geometry is dynamically optimized with varying cross-sectional areas along the flow path. The channels are designed to expand or contract at specific locations to maintain optimal flow velocity and pressure distribution, preventing severe pressure drops despite the overall minimized dimensions required for thin device profile.
4Speed
If inlet channel inlet size is smaller than outlet size, then air flow directionality is improved, but channel complexity is increased
Solution Approach 1:
The airflow channels are segmented into distinct sections with progressively varying dimensions. Each section is optimized for its specific function: inlet sections with smaller openings for directional control, intermediate sections for flow acceleration, and outlet sections for volume maximization. This segmentation achieves improved flow directionality through simple geometric progression rather than complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro blower achieves efficient heat dissipation by maximizing inlet suction and outlet exhaust amounts, providing a good cooling effect suitable for portable electronic devices with minimal thickness.
Implementation Method 1
two first piezoelectric vibrators are located on the tops and placed in the centers of the two accommodating regions, and are bonded over the sandwich metal sheet. When the two first piezoelectric vibrators are driven, each of first piezoelectric ceramic vibrators vibrates along a vibration direction, so as to change volumes of the first chamber and the second chamber to thereby generate an air flow
Implementation Method 2
heat generated by a high-heating electronic element (for example, a central processing unit or a graphics processing unit) is first guided to a cooling fin or a metal block having high heat transfer characteristics, and then conducted to a heat dissipation device (for example, a fan or a cooling fin) by means of a heat pipe effect so as to discharge the heat
Implementation Method 3
conducted to a heat dissipation device (for example, a fan or a cooling fin) by means of a heat pipe effect so as to discharge the heat
Data Source
AI summary
A micro blower includes a base metal sheet, a flowing channel layer, a sandwich metal sheet, a capping layer and two first piezoelectric vibrators. The flowing channel layer is connected to the top of the base metal sheet and includes a first chamber, a second chamber, an inlet channel, a linking channel and an outlet channel. The inlet channel links to the first chamber and includes an inlet channel inlet size and an inlet channel outlet size, and the inlet channel inlet size is smaller than the inlet channel outlet size. The linking channel links to the first chamber and the second chamber and includes a linking channel inlet size and a linking channel outlet size, and the linking channel inlet size is smaller than the linking channel outlet size.