Piezoelectric Module Layout With Embedded Circuit Weather Protection
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Solution Overview
Problem
Piezoelectric modules with circuit elements formed on substrates have low weather resistance, necessitating additional protection structures to enhance reliability.
Innovation Solution
A piezoelectric module configuration featuring a piezoelectric thin film with a functional conductor, a support substrate, and a fixing layer, where a circuit element is integrated between the thin film and the substrate, and a conductor pattern is provided on the thin film or substrate, overlapping with a void in the fixing layer, enhancing weather resistance and reducing the need for mounting components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a circuit element is formed on the surface of a substrate, then the module structure is simplified, but the weather resistance of the circuit element deteriorates
Solution Approach 1:
The circuit element is nested within the substrate thickness direction by forming it between the first surface (where the piezoelectric thin film is located) and the second surface of the substrate. This internal positioning protects the circuit element from direct environmental exposure while maintaining structural integration.
Solution Approach 2:
The circuit element is positioned in the thickness direction (z-axis) of the substrate rather than only on the surface plane. By utilizing the third dimension (depth within the substrate), the circuit element achieves both integration and environmental protection.
2Reliability
If a protection member is added to improve weather resistance, then the reliability improves, but the device complexity increases
Solution Approach 1:
The substrate serves dual functions: as the mechanical support structure and as the protective enclosure for the circuit element. By merging these two functions into a single component, the need for separate protection members is eliminated.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: providing mechanical support, housing the circuit element, and offering environmental protection. This multi-functionality removes the need for additional dedicated protection components.
3Strength
If mounting components are used to attach circuit elements, then the circuit element can be securely mounted, but the failure risk due to mounting structure increases
Solution Approach 1:
The circuit element is integrated directly into the substrate structure without separate mounting components. The substrate itself provides the mounting function through its internal cavity or embedded structure, eliminating the need for additional mounting hardware that could introduce failure points.
4Device complexity
If the circuit element is positioned away from the piezoelectric resonator, then the mounting structure is simpler, but the module size increases
Solution Approach 1:
The circuit element and piezoelectric resonator are nested within the same substrate volume, with the circuit element positioned in the thickness direction between the first and second surfaces. This nested arrangement allows close proximity without requiring additional mounting structures.
Solution Approach 2:
By utilizing the thickness direction of the substrate for positioning the circuit element, the design achieves compact integration without increasing the planar footprint. The close spacing in the z-axis dimension enables small overall module size while maintaining functional separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the weather resistance of circuit elements, reduces failure risks, and allows for a more compact module design by integrating the circuit element closely with the piezoelectric resonator, resulting in a high-reliability and smaller-sized piezoelectric module.
Implementation Method 1
a piezoelectric thin film 20 on which a functional conductor 211, 212 is provided
Data Source
AI summary
A piezoelectric module includes a piezoelectric thin film, a fixing layer, and a support substrate. The piezoelectric thin film is supported by the support substrate with the fixing layer in between. Functional conductors are provided on a surface of the piezoelectric thin film. A void is provided in the fixing layer to include a region overlapping with the functional conductors. A conductor pattern defining a circuit element is provided in a region of the void on a surface of the support substrate on the fixing layer side.