Piezoelectric Semiconductor Module Assembly Without Bonding Wires
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Solution Overview
Problem
Conventional semiconductor module manufacturing techniques face challenges such as alignment accuracy, stability of bonding wires, and high production costs due to additional bonding processes, leading to poor controllability and integration of semiconductor elements.
Innovation Solution
A semiconductor module is designed with a substrate, a shielding structure, and a piezoelectric layer, where the piezoelectric layer is directly formed on the shielding structure without an additional bonding process, improving controllability and integration by eliminating the need for extra bonding steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding technology (wire bonding, flip chip, TSV) is used to stack semiconductor elements, then interconnections between elements can be established, but alignment accuracy deteriorates and bonding wire stability decreases
Solution Approach 1:
The patent extracts and eliminates the bonding process from the semiconductor module manufacturing. Instead of using wire bonding, flip chip, or TSV to connect the piezoelectric layer to the substrate, the piezoelectric layer is directly formed on the substrate through deposition processes, removing the bonding wires and associated alignment issues entirely.
Solution Approach 2:
The patent replaces the mechanical bonding system (wire bonding, solder bumps, physical interconnections) with a direct deposition system. The piezoelectric layer is formed directly on the substrate using deposition techniques, substituting mechanical assembly with a more precise deposition-based integration approach.
2Ease of manufacture
If additional bonding processes are used to connect semiconductor elements, then interconnections can be made, but device complexity increases and controllability of individual elements deteriorates
Solution Approach 1:
The patent extracts and removes the multiple bonding processes (wire bonding, flip chip, TSV) from the manufacturing flow. The piezoelectric layer is directly formed on the substrate in a single integration step, eliminating the complex multi-step bonding sequence and improving manufacturability and element controllability.
Solution Approach 2:
The patent merges the piezoelectric layer formation with the substrate processing steps. Instead of separate bonding operations, the piezoelectric layer is directly deposited on the substrate, combining multiple manufacturing operations into a unified process that simplifies production and improves control.
3Ease of manufacture
If conventional bonding technology is used to stack SAW filter and IC substrate, then module assembly can be completed, but production cost increases due to additional bonding processes
Solution Approach 1:
The patent extracts and eliminates the costly bonding processes from the manufacturing flow. By directly forming the piezoelectric layer on the substrate without wire bonding, flip chip, or TSV operations, the patent removes multiple expensive processing steps, reducing production costs and improving manufacturing efficiency.
Data Source
AI summary
A semiconductor module and a method for manufacturing the same are provided. The semiconductor module includes a substrate comprising a front side and at least one semiconductor device formed on the front side, a shielding structure formed on the at least one semiconductor device, and a piezoelectric layer formed on the shielding structure.