Piezoelectric Module for Thin Electronic Device Vibration Feedback

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Solution Overview

Problem

The miniaturization of electronic devices with touch panels is hindered by the relatively great thickness of switch bottoms or vibration motors used for vibration feedback, which limits their size reduction potential.

Innovation Solution

Integration of a piezoelectric module with a substrate and a sensing module, where the piezoelectric element is disposed on the substrate and the sensing module is positioned over it, with a buffer element or adhesive providing a buffer between them, allowing for movement and deformation of the piezoelectric element to provide vibration feedback while reducing the overall device thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional switch bottom or vibration motor is used for vibration feedback, then vibration feedback function is achieved, but device thickness increases

Engineering Contradiction:

Improvevibration feedback functionVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent combines the vibration feedback function with the existing touch sensor structure by integrating a piezoelectric element into the sensor assembly. The piezoelectric element is disposed on the sensor substrate and extends across the sensor opening, merging the sensing and vibration feedback functions into a single integrated module, thereby eliminating the need for separate vibration motors and reducing overall device thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the traditional mechanical vibration motor with a piezoelectric element that generates vibration through electro-mechanical conversion. The piezoelectric element responds to applied voltage by deforming and generating mechanical vibrations, substituting the bulky mechanical motor system with a compact solid-state component that achieves the same vibration feedback function while significantly reducing thickness.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Length of moving object

If piezoelectric element is integrated with sensing module, then device thickness is reduced, but electrical connection between sensing module and substrate becomes more complex

Engineering Contradiction:

Improvedevice thicknessVSAvoidelectrical connection structure

Core Design Contradiction:

Length of moving objectVSDevice complexity

Solution Approach 1:

The patent introduces a buffer element as an intermediary component positioned between the piezoelectric element and the sensor module. This buffer element serves multiple functions: it provides electrical isolation between the piezoelectric element and the sensor circuitry, allows for independent positioning and mounting of the piezoelectric element, and simplifies the electrical connection structure by decoupling the sensing and vibration functions electrically while maintaining mechanical integration.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If buffer element is added between piezoelectric module and sensing module, then movement and deformation freedom is improved, but device complexity increases

Engineering Contradiction:

Improvemovement freedomVSAvoidnumber of components

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The buffer element is designed to perform multiple functions simultaneously: it provides mechanical cushioning to allow piezoelectric element deformation, serves as an electrical isolation layer, acts as a mounting substrate, and provides structural support. By consolidating these multiple functions into a single component, the design achieves high adaptability and movement freedom without proportionally increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the thickness of the electronic device to less than 0.7 millimeters, enabling miniaturization by providing effective vibration feedback without the bulk of traditional switch bottoms or vibration motors.

Implementation Method 1

The piezoelectric element is disposed on the substrate and across the opening of the substrate... The sensing module is configured to move in a direction toward the piezoelectric element to deform the piezoelectric element

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS10545581B2Semiconductor package device

Publication Date: 2020.01.28 ADVANCED SEMICON ENG INC

AI summary

An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.