Piezoelectric Multilayer Fabrication with Segmented Conductive Plugs

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Solution Overview

Problem

Conventional methods for fabricating piezoelectric multilayers face limitations in achieving desired geometry and voltage levels, restricting their performance and reliability.

Innovation Solution

A method involving the deposition of conductive and piezoelectric layers with strategically formed apertures and plugs, allowing for electrical isolation and connection, enabling the formation of a piezoelectric multilayer with improved geometry and response.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional fabrication methods are used to form piezoelectric multilayers, then the basic structure can be achieved, but the ability to obtain desired geometry and voltage levels is limited

Engineering Contradiction:
Improvegeometry controlVSAvoidfabrication complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The fabrication process is segmented into multiple sequential stages: forming first conductive layer with first aperture, depositing first piezoelectric layer, forming second conductive layer with second aperture, depositing second piezoelectric layer, and forming third conductive layer with third aperture. Each stage builds upon the previous one, allowing precise control of geometry and voltage levels while maintaining ease of manufacture through modular processing steps

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The method performs preliminary actions by pre-forming conductive layers and apertures before depositing piezoelectric layers. The first conductive layer and first aperture are formed beforehand, followed by the first piezoelectric layer. This preliminary structuring enables better control over final geometry and electrical characteristics without complicating the overall fabrication process

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If conventional fabrication methods are used, then fabrication can be performed with standard processes, but the control over layer thickness and geometry is insufficient

Engineering Contradiction:
Improvelayer thickness controlVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The device is segmented into distinct functional layers (first conductive layer, first piezoelectric layer, second conductive layer, second piezoelectric layer, third conductive layer) with each layer having specific thicknesses and geometries controlled during its formation stage. This segmentation allows independent optimization of each layer's properties without requiring complex integrated control

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention adds dimensional control by introducing multiple conductive layers at different positions (first, second, third conductive layers) with apertures at different locations and orientations. This multi-dimensional arrangement provides precise control over electric field distribution and layer thickness effects without requiring overly complex fabrication processes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies and enhances the fabrication of piezoelectric multilayers, allowing for precise control of layer thickness and geometry, leading to improved performance and reliability, particularly in applications like disk drives.

Implementation Method 1

Piezoelectric materials are used for a number of applications. For example, piezoelectric materials may be used in actuators to achieve precise positioning in response to an applied electrical signal.

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS8813324B2Method for providing a piezoelectric multilayer
Publication Date: 2014.08.26 WESTERN DIGITAL TECHNOLOGIES INC
  • US8813324B2 patent drawing
  • US8813324B2 patent drawing
  • US8813324B2 patent drawing

AI summary

A method for fabricating a piezoelectric multilayer are described. The method includes providing conductive layers. Alternating conductive layers are electrically connected. A first plurality of alternating conductive layers is electrically isolated from a second plurality of alternating conductive layers. Piezoelectric layers are interleaved with the conductive layers. Apertures are provided in the piezoelectric layers. A first conductive plug electrically connects the first plurality of alternating conductive layers, includes a first plurality of segments, and is in apertures in the piezoelectric layers. Each of the first plurality of segments extends through one of the piezoelectric layers. A second conductive plug electrically connects the second plurality of alternating conductive layers, includes a second plurality of segments, and is in a second portion of the plurality of apertures. Each of the second plurality of segments extends through one of the plurality of piezoelectric layers.