Piezoelectric Resonator Package Sealing for Frequency Stability
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Solution Overview
Problem
Piezoelectric devices with peripheral portions in contact with intermediate and sealing films experience increased frequency fluctuations due to external stress, limiting their stability and size reduction potential.
Innovation Solution
An electronic device design featuring a base substrate with a mounting surface, an intermediate layer forming an internal space with through-holes, and a sealing layer to reduce stress transfer, along with a manufacturing method involving sacrificial layers and sealing, stabilizes the mechanical vibration portion and minimizes frequency fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the peripheral portion is in contact with intermediate films and sealing films, then the device structure is simplified and manufacturing is easier, but stress is easily transferred to the vibration portion causing frequency fluctuations
Solution Approach 1:
The patent introduces a stress relief structure (intermediate layer with through-holes) as an intermediary between the peripheral portion and the vibration portion. This mediator absorbs and redistributes external stress, preventing direct stress transfer to the vibration portion while maintaining the simplified manufacturing process of direct contact between peripheral portion and sealing films
Solution Approach 2:
The patent segments the sealing structure by introducing through-holes in the intermediate layer, dividing the continuous stress transmission path into isolated sections. This segmentation prevents stress from propagating uniformly across the device, thereby protecting the vibration portion from frequency fluctuations while maintaining manufacturing simplicity
2Volume of moving object
If the device size is reduced, then the electronic device becomes more compact, but stress concentration increases affecting vibration characteristics
Solution Approach 1:
The patent applies local quality by providing stress relief features (through-holes in intermediate layer) specifically in regions where stress concentration occurs during size reduction, while maintaining the compact overall device dimensions. This localized intervention protects vibration characteristics without compromising device miniaturization
3Productivity
If the peripheral portion is directly sealed, then the sealing process is simpler and faster, but external stress is transferred to the vibration portion
Solution Approach 1:
The intermediate layer with through-holes serves as a mediator that allows the sealing process to remain simple and efficient while preventing stress transfer. The through-holes enable the intermediate layer to deform and absorb stress independently, protecting the vibration portion without complicating the sealing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces frequency fluctuations and allows for a smaller, more stable electronic device by isolating the mechanical vibration portion from external stress, enabling efficient manufacturing at the wafer level with high sealing performance.
Implementation Method 1
The piezoelectric resonator has a mechanical vibration portion that converts an electrical oscillation to a mechanical vibration by using a piezoelectric effect
Data Source
AI summary
An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.