Piezoelectric Devices in Packaging Buildup Layers

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Solution Overview

Problem

Piezoelectric materials used in electronic devices require high-temperature deposition, which is incompatible with organic substrate manufacturing, leading to increased system size and complexity due to separate assembly of piezoelectric components.

Innovation Solution

Integrating piezoelectric layers directly into the organic package substrate during manufacturing, allowing for in-situ formation of sensors and devices with reduced z-height and form factor, and enabling direct routing to other package components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If piezoelectric materials are deposited at high temperatures (over 400°C), then piezoelectric device functionality is achieved, but organic substrate manufacturing compatibility is lost since organic substrates can only withstand temperatures below 250°C

Engineering Contradiction:

Improvepiezoelectric device functionalityVSAvoidorganic substrate manufacturing compatibility

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The manufacturing process is divided into two separate sequences: (1) fabricate piezoelectric devices on a first substrate capable of withstanding high temperatures, and (2) separately fabricate the organic package substrate at lower temperatures. These separately manufactured components are then integrated, allowing each to be optimized for its respective temperature requirements without compromise

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A first substrate acts as an intermediary carrier that can withstand high temperatures during piezoelectric material deposition. This intermediary substrate is later integrated with the organic package substrate, enabling the piezoelectric components to be manufactured at high temperatures while the organic substrate is manufactured at compatible low temperatures

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If piezoelectric components are fabricated separately and assembled onto the package substrate, then manufacturing flexibility is maintained, but system z-height and area increase due to additional assembly space requirements

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidsystem z-height

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The piezoelectric device fabrication process is merged with the organic package substrate manufacturing process. Both components are fabricated in parallel on their respective substrates and then integrated in a single step, eliminating the need for separate assembly steps and reducing the overall system z-height and area

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If separate driver circuits or signal processing chips are added to the system, then device functionality is enhanced, but space requirements in x, y, and z directions increase

Engineering Contradiction:

Improvedevice functionalityVSAvoidspace requirements

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The organic package substrate is designed to perform multiple functions: it serves as both the structural package substrate and as the mounting platform for piezoelectric devices. Additionally, driver circuits and signal processing functionality are integrated directly into the package substrate, eliminating the need for separate discrete components and reducing overall space requirements

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables novel integration of piezoelectric functionality with reduced space requirements and eliminates the need for separate sensor packages, providing intimate routing and synergistic integration with other devices.

Implementation Method 1

Piezoelectric materials are used for devices that provide a range of useful functions in electronic platforms

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS11508898B2Piezoelectric devices fabricated in packaging build-up layers

Publication Date: 2022.11.22 INTEL CORP

AI summary

Piezoelectric devices are described fabricated in packaging buildup layers. In one example, a package has a plurality of conductive routing layers and a plurality of organic dielectric layers between the conductive routing layers. A die attach area has a plurality of vias to connect to a microelectronic die, the vias connecting to respective conductive routing layers. A piezoelectric device is formed on an organic dielectric layer, the piezoelectric device having at least one electrode coupled to a conductive routing layer.