High Density Interconnect for Piezoelectric Print Heads
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Solution Overview
Problem
The manufacturing of high-density piezoelectric ink jet print heads faces challenges with high material costs and complex processes due to the need for precise electrical interconnects, which are difficult to achieve with conventional methods, especially as print resolution and piezoelectric element density increase, leading to issues like electrical shorts and rework requirements.
Innovation Solution
The method involves attaching piezoelectric elements to a diaphragm with an interstitial layer and forming patterned conductive traces using optical photolithography, eliminating the need for a standoff layer and flex circuit, allowing for direct surface contact and simplifying the electrical connection process, thereby reducing material costs and improving alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If piezoelectric element density is increased to improve printing resolution, then printing resolution is improved, but manufacturing complexity and material costs increase due to difficulty in forming precise electrical interconnects
Solution Approach 1:
The patent merges the electrical interconnect function directly into the interstitial layer by forming conductive traces within it, eliminating the need for separate flex circuits and standoff layers. This integration simplifies the manufacturing process while enabling high-density piezoelectric element arrangements for improved printing resolution.
Solution Approach 2:
The patent extracts and eliminates the standoff layer and flex circuit components from the conventional structure, retaining only the essential electrical interconnection function through conductive traces formed in the interstitial layer. This reduction in components simplifies manufacturing while maintaining electrical connectivity.
2Manufacturing precision
If piezoelectric element density is increased to improve printing resolution, then printing resolution is improved, but material costs increase due to complex processes and precise interconnect requirements
Solution Approach 1:
The patent combines multiple functions (structural support, electrical interconnection, and alignment) into the interstitial layer with integrated conductive traces, eliminating the need for separate standoff layers and flex circuits. This reduction in component count and process steps lowers material costs while enabling high-density piezoelectric element configurations.
Solution Approach 2:
The patent removes unnecessary components (standoff layer, flex circuit) from the conventional structure, retaining only the essential electrical interconnection function. This simplification reduces material requirements and manufacturing complexity, thereby reducing material costs.
3Ease of manufacture
If conventional manufacturing methods are used for high-density jet stacks, then manufacturing processes are established, but electrical connection reliability decreases due to alignment issues and electrical shorts
Solution Approach 1:
The patent integrates electrical interconnects directly into the interstitial layer structure, ensuring precise alignment and reliable electrical connections. This unified structure eliminates alignment issues between separate components and prevents electrical shorts, thereby improving electrical connection reliability.
Solution Approach 2:
The patent eliminates the standoff layer and flex circuit components that cause alignment difficulties and electrical shorts in conventional designs. By removing these problematic components, the patent achieves more reliable electrical connections through directly formed conductive traces.
4Quantity of substance
If the number of ports is increased to support more jets, then jet density is improved, but device complexity increases due to space constraints and material selection restrictions
Solution Approach 1:
The patent merges the electrical interconnect function into the interstitial layer, eliminating the need for separate flex circuits and standoff layers. This integration frees up space within the print head structure, allowing for increased port density and higher jet density without exacerbating space constraints.
Solution Approach 2:
The patent removes the standoff layer and flex circuit components that consume valuable space within the print head. This extraction creates additional space for ports and other functional elements, enabling higher jet density while managing space constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the formation of high-density jet stacks, reduces material costs, and enhances electrical connection reliability, enabling higher transducer densities and improved printing resolution without the need for complex standoff layers or flex circuits, thus addressing the limitations of conventional manufacturing methods.
Implementation Method 1
When a voltage is applied to the piezoelectric element, typically through electrical connection with an electrode electrically coupled to a voltage source, the piezoelectric element bends or deflects, causing the diaphragm to flex which expels a quantity of ink from a chamber through a nozzle
Implementation Method 2
forming a plurality of patterned traces on the interstitial layer to electrically contact the plurality of piezoelectric elements
Data Source
AI summary
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.