Piezoelectric Pump Layout for Cooling Optical Communication Modules
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Solution Overview
Problem
The challenge of effectively dissipating heat generated by high-speed optical communication modules in optical communication servers due to inadequate airflow from chassis-mounted fans is addressed.
Innovation Solution
Integration of miniaturized piezoelectric pumps mounted on the detachable chassis of optical communication modules to generate airflow directly for heat dissipation, utilizing a piezoelectric vibration mechanism to create air flow through flexible films and controlled openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans are mounted on the chassis to generate airflow for heat dissipation, then the heat dissipation system is simple to implement, but the airflow is insufficient to meet the heat dissipation requirements of high-speed optical communication modules
Solution Approach 1:
The patent divides the heat dissipation system into multiple independent piezoelectric pumps, each mounted on individual optical communication modules. This segmentation allows each module to generate its own airflow for heat dissipation, ensuring sufficient cooling capacity for high-speed modules while maintaining system effectiveness.
Solution Approach 2:
The patent replaces the traditional mechanical fan system with piezoelectric pumps that utilize piezoelectric vibration mechanisms. This substitution enables more efficient airflow generation at the module level, significantly improving heat dissipation effectiveness compared to chassis-mounted fans.
2Temperature
If piezoelectric pumps are integrated for efficient heat dissipation, then the thermal management performance is improved, but the device volume increases
Solution Approach 1:
The piezoelectric pumps are mounted directly on the optical communication modules, nesting the cooling function within the existing module structure. This integration minimizes additional volume while achieving efficient heat dissipation at the source.
Solution Approach 2:
The patent employs flexible films as vibration membranes in the piezoelectric pumps, which are thin and lightweight. These flexible films enable effective airflow generation while occupying minimal space, thus improving heat dissipation efficiency without significantly increasing device volume.
3Volume of moving object
If miniaturized piezoelectric pumps are used, then the volume occupied is reduced, but the airflow generation capability may be compromised
Solution Approach 1:
The miniaturized piezoelectric pumps utilize high-frequency piezoelectric vibration mechanisms to generate airflow. The vibration frequency and amplitude are optimized to maximize airflow generation within the constrained miniaturized volume, maintaining sufficient cooling capability despite the reduced size.
Solution Approach 2:
The patent optimizes key parameters of the piezoelectric pumps including vibration frequency, membrane permeability, and chamber dimensions. By carefully adjusting these parameters, the miniaturized pumps achieve effective airflow generation that meets heat dissipation requirements while occupying minimal volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat dissipation for each optical communication module, reducing the volume occupied by the pumps and enhancing thermal management in optical communication devices.
Implementation Method 1
a piezoelectric element 42 affixed between the first vibration plate 41 and the second vibration plate 43
Implementation Method 2
utilizing a piezoelectric vibration mechanism to create air flow through flexible films and controlled openings
Data Source
AI summary
A piezoelectric pump and an electronic device are provided. The piezoelectric pump is mounted on the electronic device, and includes a housing, an inlet structure, and an outlet structure, and a piezoelectric vibration mechanism. The housing includes first openings and second openings. The inlet structure is disposed on the inner surface of the housing, and includes an inlet body having inlet holes positioned correspondingly to the first openings; and first films connected to the inlet body, and in the inlet holes. The outlet structure is disposed on the outer surface of the housing, and includes outlet body having outlet holes positioned correspondingly to the second openings; and second films connected to the outlet body, and in the outlet holes. The piezoelectric vibration mechanism is in the housing.


