Piezoelectric Resonator with Interdigital Electrode for High Figure of Merit
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Solution Overview
Problem
Existing resonators in nano-electromechanical systems (NEMS) and micro-electromechanical systems (MEMS) face challenges due to low Figure of Merit and design/material limitations, limiting their scalability and application potential.
Innovation Solution
A resonator design incorporating a piezoelectric plate with an interdigital electrode, configured to operate in a combined mode of vibration comprising thickness-extensional and lateral-extensional modes, and a method of fabrication involving a piezoelectric layer over a substrate, electrode patterning, and etching to form a micro- or nano-plate, allowing for enhanced electromechanical coupling and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pre-existing resonator designs are used, then fabrication is simpler, but Figure of Merit is low and scalability is limited
Solution Approach 1:
The patent changes the geometric parameters of the resonator, specifically setting the thickness-to-pitch ratio between 0.5 and 1.5, which optimizes the electromechanical coupling and achieves high Figure of Merit while maintaining fabrication compatibility
Solution Approach 2:
The resonator employs composite structure combining piezoelectric material with specific geometric configuration, achieving enhanced performance by integrating material properties with optimized dimensions
2Device complexity
If pre-existing resonator designs are used, then design is simpler, but scalability is limited due to material limitations
Solution Approach 1:
The patent identifies and optimizes critical geometric parameters, particularly the thickness-to-pitch ratio, enabling scalable design across different size regimes while maintaining high performance
Solution Approach 2:
The invention transitions from conventional lateral-mode resonators to thickness-extensional mode resonators, utilizing the thickness dimension for vibration, which enables better scaling behavior and overcomes material thickness limitations
3Reliability
If thickness-to-pitch ratio is optimized between 0.5 and 1.5, then electromechanical coupling is enhanced, but fabrication precision requirements increase
Solution Approach 1:
The patent establishes an optimal range (0.5 to 1.5) for the thickness-to-pitch ratio, providing a design window that achieves high electromechanical coupling while accommodating typical fabrication tolerances
Solution Approach 2:
The optimized geometric configuration serves multiple functions: enhancing electromechanical coupling, maintaining high quality factor, and providing tolerance to fabrication variations, making the design universally applicable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high Figure of Merit, enabling low motional resistance, high gain, and compact MEMS resonators suitable for advanced wireless communication and sensing applications, with improved performance in terms of quality factor and electromechanical coupling coefficient.
Implementation Method 1
a resonator including a piezoelectric plate and an interdigital electrode; the resonator may be configured to operate in a combined mode of vibration comprising a thickness-extensional mode and a lateral-extensional mode
Data Source
AI summary
A resonator including a piezoelectric plate and an interdigital electrode is provided. A ratio between a thickness of the plate and a pitch of the interdigital electrode may be from about 0.5 to about 1.5. A radiation detector including a resonator and an absorber layer capable of absorbing at least one of infrared and terahertz radiation is provided. A resonator including a piezoelectric plate and a two-dimensional electrically conductive material is provided.