Piezoelectric Resonator Integration with Substrate Circuitry
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Solution Overview
Problem
Conventional quartz resonators are limited in size due to fabrication and encapsulation methods, making integration with smaller-sized products challenging, especially as silicon-based integrated circuit technology advances.
Innovation Solution
Integration of piezoelectric materials with substrates, including the use of a substrate, cap with integrated circuitry, and electrically conductive material to form a sealed volume containing a micromechanical resonator, allowing for signal transmission between the resonator and circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fabrication and encapsulation methods are used, then quartz resonators can be manufactured with stable temperature and high Q, but their size is limited to about 2.5 mm×2.0 mm
Solution Approach 1:
The patent merges the resonator, control circuitry, and packaging into a single integrated device. The control circuitry is fabricated directly on the resonator substrate, eliminating the need for separate external circuitry and enabling miniaturization while maintaining the reliability benefits of quartz resonators.
Solution Approach 2:
The patent implements a nested structure where the control circuitry is embedded within the packaging structure that also contains the resonator. The circuitry is fabricated on the same substrate as the resonator, creating a compact nested arrangement that reduces overall device size while preserving the resonator's temperature stability and high Q characteristics.
2Reliability
If conventional packaging methods are used, then quartz resonators maintain their performance characteristics, but integration with smaller-sized products is difficult
Solution Approach 1:
The patent combines the resonator, control circuitry, and packaging functions into a single integrated device. This merging enables the resonator to be adapted to smaller product sizes while maintaining its performance characteristics through on-chip integration of all necessary components.
Solution Approach 2:
The integrated device structure serves multiple functions simultaneously: the substrate acts as both the resonator support and the circuitry platform, the packaging provides both mechanical protection and electrical interconnection. This multi-functionality enhances adaptability to various application sizes and types while preserving resonator performance.
3Ease of manufacture
If resonators are individually packaged with minimal electrical circuitry, then manufacturing is simplified, but connections to control circuitry must be made externally
Solution Approach 1:
The patent merges the control circuitry fabrication with the resonator manufacturing process. Both are fabricated on the same substrate using compatible processes, eliminating the need for separate packaging and external circuitry assembly steps, thereby simplifying manufacturing while reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of smaller, more integrated micromechanical resonators that can be effectively controlled and sensed, facilitating their use in smaller-sized products by providing a sealed environment for the resonator and enabling efficient communication with integrated circuitry.
Implementation Method 1
a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume
Data Source
AI summary
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.