Piezoelectric Resonator Structure With Protrusions for Thin Substrates
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Solution Overview
Problem
Conventional resonance devices face challenges in reducing size while maintaining rigidity, leading to potential deformation and breakage due to reduced substrate thickness.
Innovation Solution
The design incorporates a protruding portion on the inner surface of the substrates to enhance rigidity, allowing for reduced thickness without compromising vibration performance, by forming a recess and protruding portion on the lower substrate and optionally on the upper substrate to increase the vibration space and prevent contact during vibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thicknesses of the lower substrate and the upper substrate are reduced to decrease the thickness of the resonance device, then the size of the resonance device is reduced, but the rigidity of the substrates is reduced, leading to deformation or breakage
Solution Approach 1:
The invention transitions from a conventional planar substrate structure to a three-dimensional structure by forming protruding portions that extend into the vibration space. This dimensional change allows the substrate to maintain reduced thickness while gaining additional rigidity through the protruding structures that provide mechanical support without increasing the overall device thickness.
Solution Approach 2:
The invention applies local quality by creating protruding portions at specific locations on the substrate rather than uniformly increasing substrate thickness throughout. These protruding portions are strategically positioned to provide localized rigidity enhancement where needed, while maintaining thin substrate regions where vibration space is critical, thus resolving the contradiction between overall thickness reduction and localized rigidity requirements.
2Volume of moving object
If the thicknesses of the lower substrate and the upper substrate are reduced to decrease the thickness of the resonance device, then the size of the resonance device is reduced, but deformation such as warpage may occur in the substrates
Solution Approach 1:
By introducing protruding portions that extend vertically from the substrate surface into the vibration space, the invention adds a third-dimensional structural element that provides warpage resistance. This dimensional enhancement creates a more stable substrate configuration that can maintain its shape even when the overall substrate thickness is reduced, thereby preventing deformation while keeping the device compact.
Solution Approach 2:
The protruding portions are formed in advance during the substrate manufacturing process, creating pre-reinforced structures that proactively prevent warpage and deformation before the device is assembled and operated. This preliminary structural reinforcement ensures substrate stability is built-in from the manufacturing stage, eliminating the need for thicker substrates to prevent deformation.
3Volume of moving object
If the thicknesses of the lower substrate and the upper substrate are reduced to decrease the thickness of the resonance device, then the size of the resonance device is reduced, but the substrates will break due to impact
Solution Approach 1:
The invention uses the vertical dimension to create protruding portions that act as shock-absorbing and impact-resisting structures. When impact occurs, these protruding portions provide additional structural pathways to distribute and absorb impact forces, preventing substrate breakage even when the overall substrate thickness is reduced to minimize device size.
Solution Approach 2:
The protruding portions serve as pre-positioned structural reinforcements that provide impact protection before any impact event occurs. By building these reinforcing structures into the substrate during manufacturing, the device is pre-equipped with impact resistance capabilities, allowing thin substrates to withstand shocks and impacts that would otherwise cause breakage in conventional thin-substrate designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the size of the resonance device while preventing deformation and breakage, maintaining stable vibration performance and rigidity.
Implementation Method 1
a protruding portion that is formed on an inner surface of the lower substrate or an inner surface of the upper substrate and that protrudes in the vibration space
Implementation Method 2
each of the plurality of vibration arms having a fixed end, which is connected to an end of the base portion, and a free end. Moreover, each of the vibration arms vibrates in the vertical direction toward the lower substrate or the upper substrate in accordance with the orientation of the electric field applied thereto
Implementation Method 3
each of the vibration arms vibrates in the vertical direction toward the lower substrate or the upper substrate in accordance with the orientation of the electric field applied thereto
Data Source
AI summary
A resonance device is provided with a reduced size and also suppresses the occurrence of deformation and breakage during operation. The resonance device includes a lower substrate, an upper substrate that defines a vibration space between the lower substrate and the upper substrate, a protruding portion that is formed on an inner surface of the lower or upper substrates. Moreover, a resonator is disposed in the vibration space and includes a base portion and vibration arms that extend in parallel to one another from the base portion along the inner surface of the lower substrate or the inner surface of the upper substrate and that vibrate in a vertical direction toward the inner surface of the lower substrate or the inner surface of the upper substrate.