Piezoelectric Sensor Bonding Member Young's Modulus
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Solution Overview
Problem
Conventional pressing sensors face challenges in accurately detecting the magnitude of the force applied to an operation panel due to high Young's modulus of the bonding member, which inhibits deformation of the piezoelectric film and reduces the generated charge, making it difficult to differentiate between pressing positions.
Innovation Solution
A sensor design with a bonding member having a Young's modulus of 0 MPa to 10 MPa, allowing for accurate detection of the force applied by enabling sufficient deformation and charge generation of the piezoelectric film, which is capable of distinguishing between different pressing positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding member with high Young's modulus is used to fix the electrode member to the piezoelectric film, then the bonding strength and structural stability are improved, but the deformation capability of the piezoelectric film is inhibited and the generated charge is reduced
Solution Approach 1:
The patent changes the key parameter of Young's modulus of the bonding member from high (conventional) to low (0-10 MPa range). This parameter change allows the bonding member to be sufficiently soft to permit piezoelectric film deformation while still providing adequate bonding, thereby enabling accurate force detection through adequate charge generation.
Solution Approach 2:
The patent employs a flexible bonding member with specifically controlled low Young's modulus (0-10 MPa) that can deform elastically under pressing forces. This flexible bonding member allows the piezoelectric film to deform and generate charge while maintaining sufficient bonding strength, resolving the contradiction between bonding strength and deformation capability.
2Measurement precision
If a bonding member with low Young's modulus is used to allow piezoelectric film deformation, then the force detection accuracy is improved, but the bonding strength and structural stability are reduced
Solution Approach 1:
The patent optimizes the Young's modulus parameter of the bonding member to a specific low range (0-10 MPa). This parameter optimization ensures the bonding member is soft enough to permit necessary deformation for accurate force detection while maintaining sufficient bonding strength to keep the electrode member securely attached during operation.
Solution Approach 2:
The patent uses a bonding member with specifically controlled low Young's modulus properties that combines sufficient bonding capability with high flexibility. This specialized material allows the system to achieve both strong bonding and adequate deformation, resolving the contradiction between these two requirements.
3Stability of the object's composition
If the piezoelectric film is rigidly fixed to maintain structural stability, then the structural stability is improved, but the deformation and charge generation capability are reduced
Solution Approach 1:
The patent employs a flexible bonding member with low Young's modulus (0-10 MPa) that allows the piezoelectric film to deform elastically under pressing forces while maintaining structural stability during normal operation. This flexible fixation enables both structural stability and adequate deformation for charge generation.
Solution Approach 2:
The patent changes the rigidity parameter of the bonding member from high to low (0-10 MPa range), allowing the piezoelectric film to deform and generate charge while maintaining sufficient structural stability through the bonding member's controlled flexibility rather than rigidity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor accurately detects the magnitude of the force applied to the operation panel by generating sufficient electric charges, overcoming the limitations of high Young's modulus bonding members in conventional sensors.
Implementation Method 1
a piezoelectric film (14) including an upper principal surface and a lower principal surface aligned in an up-down direction
Data Source
AI summary
A sensor that includes: a piezoelectric film including an upper principal surface and a lower principal surface aligned in an up-down direction; a lower electrode on the lower principal surface of the piezoelectric film; an electrode member including an upper electrode; and a bonding member that fixes the electrode member to the upper principal surface of the piezoelectric film. A Young's modulus of the bonding member is 0 MPa to 10 MPa.


