Pressure-Bonded Piezoelectric Sensor Wiring for Heat and Flexibility
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Solution Overview
Problem
Existing wiring connection structures for sol-gel composite piezoelectric sensors compromise the flexibility and durability of the sensors, particularly in high-temperature environments.
Innovation Solution
A sensor device with a sol-gel composite piezoelectric sensor unit connected to a wiring portion, featuring a protective layer covering the electrode layer except for a flat portion, a pressure-bonding tip for stable connection, and a housing portion to ensure mechanical strength and flexibility, with heat-resistant wiring and a pressure-applying mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring connection structure is configured to ensure stability and durability such as mechanical strength, then reliability is improved, but flexibility is degraded
Solution Approach 1:
The sensor device is divided into distinct functional segments: the flexible sol-gel composite piezoelectric sensor unit and the rigid wiring connection structure. This segmentation allows each component to optimize its properties independently - the sensor unit maintains flexibility for conformability while the wiring portion provides structural stability and durability for reliable connections.
2Strength
If a wiring connection structure is configured to ensure mechanical strength, then strength is improved, but flexibility is degraded
Solution Approach 1:
The device separates the mechanical strength requirements to the wiring connection structure while the sensor unit itself remains flexible. The wiring portion with its robust construction provides the necessary mechanical strength for stable connections, whereas the sol-gel composite sensor unit maintains its inherent flexibility for conforming to surfaces.
Solution Approach 2:
Different parts of the device have different mechanical properties tailored to their specific functions. The wiring connection structure is designed with high mechanical strength characteristics for stable electrical connections, while the sensor unit portion is designed with high flexibility for conformability to the monitored surface.
3Reliability
If a wiring connection structure is configured to ensure stability, then reliability is improved, but the flexibility of the sol-gel composite piezoelectric sensor is degraded
Solution Approach 1:
The sensor device is segmented into the flexible sol-gel composite piezoelectric sensor unit and the stable wiring connection structure. This segmentation ensures that the sensor unit can maintain its flexibility for conformability while the wiring portion provides the stability needed for reliable signal transmission and electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains flexibility and mechanical strength while ensuring heat resistance, allowing the sensor to operate effectively in high-temperature environments without compromising its functionality.
Implementation Method 1
a pressure-applying portion configured to press the flat portion of the pressure-bonding tip to the portion of the electrode layer that is not covered by the protective layer so as to provide pressure bonding
Implementation Method 2
a sol-gel composite piezoelectric sensor... provided with a piezoelectric film layer
Data Source
AI summary
In a sensor device, a sensor unit and a wiring portion are connected. The sensor unit is configured as a sol-gel composite piezoelectric sensor including a base material layer, a piezoelectric film layer formed on the base material layer, an electrode layer formed on the piezoelectric film layer, and a protective layer. The base material layer and the electrode layer are covered by the protective layer except for a portion thereof. The wiring portion includes a signal line and a ground line. The signal line has an end having a pressure-bonding tip. An upper housing portion and a lower housing portion cover at least uncovered portions of the sensor unit and the wiring portion. A pressure-applying portion presses the pressure-bonding tip in contact with a portion of the electrode layer that is not covered by the protective layer, so as to pressure-bond them.