Piezoelectric Element Structure for High-Frequency Shear Vibration
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Solution Overview
Problem
Existing piezoelectric devices face challenges in achieving high-frequency operation while maintaining mechanical strength and low equivalent series resistance, due to limitations in the design of piezoelectric elements that operate in thickness-shear vibration mode.
Innovation Solution
A piezoelectric element with a quadrangular vibration portion and a thicker holding portion, integrated with inclined and through-hole configurations, which supports the vibration portion and reduces strain, allowing for higher frequency operation and lower equivalent series resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the piezoelectric element operates at higher frequency, then the oscillation frequency is improved, but the mechanical strength deteriorates due to increased strain
Solution Approach 1:
The piezoelectric element is divided into two distinct portions: a vibration portion with smaller thickness for high-frequency operation, and a holding portion with larger thickness for mechanical strength. This segmentation allows each portion to be optimized independently for its specific function.
Solution Approach 2:
Different thicknesses are applied locally to different portions of the piezoelectric element. The vibration portion has a first thickness optimized for high-frequency vibration, while the holding portion has a second thickness (greater than the first) optimized for mechanical support and strain reduction.
2Speed
If the piezoelectric element operates at higher frequency, then the oscillation frequency is improved, but the equivalent series resistance increases
Solution Approach 1:
The element is segmented into vibration and holding portions with different thicknesses, allowing the vibration portion to be optimized for high-frequency operation with lower equivalent series resistance while the holding portion provides structural support.
Solution Approach 2:
The thickness parameter is changed between different portions of the element. The vibration portion uses a smaller thickness parameter to reduce equivalent series resistance and enable higher frequency operation, while the holding portion uses a larger thickness parameter for mechanical stability.
3Speed
If the thickness of the piezoelectric element is reduced for high-frequency operation, then the oscillation frequency is improved, but the mechanical strength deteriorates
Solution Approach 1:
The element is divided into a vibration portion with smaller thickness for high-frequency operation and a holding portion with larger thickness for mechanical strength, resolving the contradiction between thinness for frequency and thickness for strength.
Solution Approach 2:
Different thickness characteristics are applied locally: the vibration portion has a first thickness optimized for frequency response, while the holding portion has a second thickness (greater than the first) optimized for mechanical support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design enables higher frequency operation with maintained mechanical strength and reduced equivalent series resistance, enhancing the performance of piezoelectric devices by effectively confining vibration energy and reducing strain.
Implementation Method 1
A piezoelectric device utilizes the piezoelectric effect and the inverse piezoelectric effect of a piezoelectric element to generate a specified oscillation frequency
Implementation Method 2
A piezoelectric device utilizes the piezoelectric effect and the inverse piezoelectric effect of a piezoelectric element to generate a specified oscillation frequency
Data Source
AI summary
A piezoelectric element includes a vibration portion, a holding portion, excitation electrodes, mounted electrodes, and wiring electrodes. A vibration main surface and a holding main surface are on the same plane. A holding main surface includes a fixing portion configured to be in contact with an element mounting member. The mounted electrodes are located side by side on the fixing portion. An inner side edge of the mounted electrode and an inner side edge of the wiring electrode are connected in a straight line. An inner side edge of the mounted electrode and an inner side edge of the wiring electrode are connected in a straight line.