Piezoelectric Substrate Thickness Control via Isolated Electrodes

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Solution Overview

Problem

Existing piezoelectric substrate manufacturing methods face challenges in achieving accurate thickness control due to contamination of measurement electrodes during plasma etching, which reduces measurement accuracy and processing efficiency.

Innovation Solution

A piezoelectric substrate manufacturing device with separate measurement and processing electrodes, where the measurement electrode is positioned outside a cover to prevent contamination, and a control unit coordinates the relative positions and plasma processing to maintain accurate thickness measurement and processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the same electrode is used for both measurement and processing, then positional errors are reduced and processing accuracy is improved, but the measurement electrode becomes contaminated by plasma fumes and particles, reducing measurement accuracy

Engineering Contradiction:

Improveprocessing accuracyVSAvoidmeasurement accuracy

Core Design Contradiction:

Manufacturing precisionVSMeasurement precision

Solution Approach 1:

The invention divides the electrode system into two separate components: a measurement electrode and a processing electrode. The measurement electrode remains outside the cover and is not exposed to plasma, while the processing electrode is inside the cover where plasma generation occurs. This segmentation allows each electrode to perform its specific function without interference, resolving the contradiction between maintaining measurement accuracy and achieving processing accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The measurement electrode is extracted from the plasma processing environment by positioning it outside the cover. This extraction prevents the measurement electrode from being contaminated by plasma fumes and particles, while the processing electrode remains inside to perform the plasma processing function. The relative positioning mechanism ensures both electrodes can work independently without contamination cross-over.

Inventive Principle:

Principle #2Taking out (Extraction)

2Measurement precision

If the measurement electrode is washed to restore measurement accuracy, then measurement accuracy is improved, but processing efficiency is reduced

Engineering Contradiction:

Improvemeasurement accuracyVSAvoidprocessing efficiency

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The invention applies preliminary protective action by positioning the measurement electrode outside the cover before plasma processing begins. This preventive measure eliminates the need for subsequent cleaning operations, as the measurement electrode is never exposed to plasma contamination in the first place. The relative positioning mechanism ensures this protective configuration is maintained throughout the process.

Inventive Principle:

Principle #9Preliminary anti-action

3Measurement precision

If separate measurement and processing electrodes are used, then measurement accuracy is maintained, but positional errors between measurement and processing steps increase

Engineering Contradiction:

Improvemeasurement accuracyVSAvoidprocessing accuracy

Core Design Contradiction:

Measurement precisionVSManufacturing precision

Solution Approach 1:

The invention implements a dynamic relative positioning mechanism that adjusts the positions of the measurement electrode and processing electrode based on the piezoelectric substrate thickness and processing requirements. This dynamic adjustment ensures optimal positioning for both measurement and processing operations, minimizing positional errors while maintaining measurement accuracy. The system can adapt its configuration rather than being fixed.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves processing accuracy by reducing positional errors and maintaining measurement accuracy, allowing for precise thickness control and efficient plasma processing.

Implementation Method 1

performing surface processing on the piezoelectric substrate by applying a voltage between the first electrode and the second electrode and causing the processing gas to change into plasma

Methodology Applied

Scientific EffectPlasma: Plasma

Data Source

PatentUS11437566B2Piezoelectric substrate manufacturing device and piezoelectric substrate manufacturing method

Publication Date: 2022.09.06 MURATA MFG CO LTD

AI summary

A piezoelectric substrate manufacturing device that includes first and electrodes that face each other with a piezoelectric substrate interposed therebetween; a cover that surrounds the second electrode such that the leading end of the second electrode is exposed; a supply unit that supplies a processing gas to an internal space of the cover; a processing unit that performs surface processing on the piezoelectric substrate by applying a voltage between the first and second electrodes causing the processing gas to change into plasma; a detector that is provided outside the cover with its relative position fixed with respect to the second electrode; a measurement unit that measures the thickness of the piezoelectric substrate using the detector; a driving unit that changes the relative positions of the first and second electrodes; and a control unit that controls the supply unit, the processing unit, the measurement unit, and the driving unit.